Noriyuki Tatsumi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon device structure, and sputtering target used for forming th...
- Patent number 8,410,581
- Issue date Apr 2, 2013
- Hitachi Cable Ltd.
- Noriyuki Tatsumi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon device structure, and sputtering target used for forming th...
- Patent number 8,368,184
- Issue date Feb 5, 2013
- Hitachi Cable Ltd.
- Noriyuki Tatsumi
Information Patent Grant
Interconnecting structure production method, and interconnecting st...
- Patent number 8,227,347
- Issue date Jul 24, 2012
- Hitachi Cable, Ltd.
- Noriyuki Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method for fabricating the same
- Patent number 8,173,905
- Issue date May 8, 2012
- Hitachi Cable, Ltd.
- Noriyuki Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method for fabricating the same
- Patent number 7,884,010
- Issue date Feb 8, 2011
- Hitachi Cable, Ltd.
- Noriyuki Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum stabilized superconductor with Cu and Mg
- Patent number 6,255,596
- Issue date Jul 3, 2001
- Hitachi Cable Ltd.
- Fumikazu Hosono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite metal oxide material
- Patent number 5,998,050
- Issue date Dec 7, 1999
- International Superconductivity Technology Center
- Yasuji Yamada
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for preparing an oxide superconducting tape
- Patent number 5,731,271
- Issue date Mar 24, 1998
- Mitsubishi Cable Industries, Ltd.
- Shigenori Yuhya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing composite metal oxide material
- Patent number 5,627,142
- Issue date May 6, 1997
- International Superconductivity Technology Center
- Yasuji Yamada
- C30 - CRYSTAL GROWTH
Information Patent Grant
Process for depositing oxide film on metallic substrate by heat pla...
- Patent number 5,453,306
- Issue date Sep 26, 1995
- International Superconductivity Technology Center
- Noriyuki Tatsumi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SILICON DEVICE STRUCTURE, AND SPUTTERING TARGET USED FOR FORMING TH...
- Publication number 20130126345
- Publication date May 23, 2013
- Hitachi Cable, Ltd.
- Noriyuki TATSUMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECTING STRUCTURE PRODUCTION METHOD, AND INTERCONNECTING ST...
- Publication number 20120248611
- Publication date Oct 4, 2012
- Hitachi Cable, Ltd.
- Noriyuki TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON DEVICE STRUCTURE, AND SPUTTERING TARGET USED FOR FORMING TH...
- Publication number 20120007077
- Publication date Jan 12, 2012
- Hitachi Cable, Ltd.
- Noriyuki TATSUMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cu-Ga ALLOY MATERIAL, SPUTTERING TARGET, METHOD OF MAKING Cu-Ga ALL...
- Publication number 20110284372
- Publication date Nov 24, 2011
- Hitachi Cable, Ltd.
- Yuichi HIRAMOTO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SPUTTERING TARGET MATERIAL
- Publication number 20110139615
- Publication date Jun 16, 2011
- HITACHI CABLE, LTD.
- Noriyuki Tatsumi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
INTERCONNECTING STRUCTURE PRODUCTION METHOD, AND INTERCONNECTING ST...
- Publication number 20100264415
- Publication date Oct 21, 2010
- Hitachi Cable, Ltd.
- Noriyuki TATSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure and method for fabricating the same
- Publication number 20100096755
- Publication date Apr 22, 2010
- Hitachi Cable, Ltd.
- Noriyuki Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring structure and method for fabricating the same
- Publication number 20100096172
- Publication date Apr 22, 2010
- Hitachi Cable, Ltd.
- Noriyuki Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER SPUTTERING TARGET MATERIAL AND SPUTTERING METHOD
- Publication number 20100000857
- Publication date Jan 7, 2010
- HITACHI CABLE, LTD.
- Tatsuya TONOGI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Noriyuki Tatsumi

Person

Patents Grantslast 30 patents

Silicon device structure, and sputtering target used for forming th...

Silicon device structure, and sputtering target used for forming th...

Interconnecting structure production method, and interconnecting st...

Wiring structure and method for fabricating the same

Wiring structure and method for fabricating the same

Aluminum stabilized superconductor with Cu and Mg

Composite metal oxide material

Method for preparing an oxide superconducting tape

Method of producing composite metal oxide material

Process for depositing oxide film on metallic substrate by heat pla...

Patents Applicationslast 30 patents

SILICON DEVICE STRUCTURE, AND SPUTTERING TARGET USED FOR FORMING TH...

INTERCONNECTING STRUCTURE PRODUCTION METHOD, AND INTERCONNECTING ST...

SILICON DEVICE STRUCTURE, AND SPUTTERING TARGET USED FOR FORMING TH...

Cu-Ga ALLOY MATERIAL, SPUTTERING TARGET, METHOD OF MAKING Cu-Ga ALL...

SPUTTERING TARGET MATERIAL

INTERCONNECTING STRUCTURE PRODUCTION METHOD, AND INTERCONNECTING ST...

Wiring structure and method for fabricating the same

Wiring structure and method for fabricating the same

COPPER SPUTTERING TARGET MATERIAL AND SPUTTERING METHOD