Norliza Morban

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods for manufacturing thereof
- Patent number 12,300,559
- Issue date May 13, 2025
- Infineon Technologies AG
- Si Hao Vincent Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with metal posts from structured leadframe
- Patent number 12,176,222
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,021,000
- Issue date Jun 25, 2024
- Infineon Technologies AG
- Khay Chwan Andrew Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of conductive connection tracks in package mold body usin...
- Patent number 11,296,000
- Issue date Apr 5, 2022
- Infineon Technologies AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frames for semiconductor packages
- Patent number 11,152,288
- Issue date Oct 19, 2021
- Infineon Technologies AG
- Eric Lopez Bonifacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of conductive connection tracks in package mold body usin...
- Patent number 10,741,466
- Issue date Aug 11, 2020
- Infineon Technologies AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170329
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Sock Chien Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME
- Publication number 20230170226
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods for Manufacturing Thereof
- Publication number 20220199478
- Publication date Jun 23, 2022
- Si Hao Vincent Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20220037222
- Publication date Feb 3, 2022
- Khay Chwan Andrew Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of Conductive Connection Tracks in Package Mold Body Usin...
- Publication number 20200350222
- Publication date Nov 5, 2020
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
- Publication number 20200343166
- Publication date Oct 29, 2020
- INFINEON TECHNOLOGIES AG
- Eric Lopez Bonifacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of Conductive Connection Tracks in Package Mold Body Usin...
- Publication number 20190157173
- Publication date May 23, 2019
- INFINEON TECHNOLOGIES AG
- Cher Hau Danny Koh
- H01 - BASIC ELECTRIC ELEMENTS

Norliza Morban

Person

Patents Grantslast 30 patents

Semiconductor packages and methods for manufacturing thereof

Semiconductor package with metal posts from structured leadframe

Semiconductor package and method for fabricating a semiconductor pa...

Formation of conductive connection tracks in package mold body usin...

Lead frames for semiconductor packages

Formation of conductive connection tracks in package mold body usin...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME

SEMICONDUCTOR PACKAGE WITH METAL POSTS FROM STRUCTURED LEADFRAME

Semiconductor Packages and Methods for Manufacturing Thereof

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

Formation of Conductive Connection Tracks in Package Mold Body Usin...

LEAD FRAMES FOR SEMICONDUCTOR PACKAGES

Formation of Conductive Connection Tracks in Package Mold Body Usin...