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Norton J. Tomassetti
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Kingston, NY, US
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Patents Grants
last 30 patents
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Patent Grant
High bandwidth 3D memory packaging technique
Patent number
6,469,375
Issue date
Oct 22, 2002
William F. Beausoleil
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
High-density board connector attachment
Patent number
5,622,520
Issue date
Apr 22, 1997
International Business Machines Corporation
Peter L. Dutka
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
HIGH BANDWIDTH 3D MEMORY PACKAGING TECHNIQUE
Publication number
20020117741
Publication date
Aug 29, 2002
William F. Beausoleil
H01 - BASIC ELECTRIC ELEMENTS