Norzafriza NITTA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal particle-containing composition and electrically conductive a...
- Patent number 11,466,181
- Issue date Oct 11, 2022
- Furukawa Electric Co., Ltd.
- Norzafriza Nitta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING BONDING MATE...
- Publication number 20240408703
- Publication date Dec 12, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...
- Publication number 20220139864
- Publication date May 5, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...
- Publication number 20210348038
- Publication date Nov 11, 2021
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL PARTICLE-CONTAINING COMPOSITION AND ELECTRICALLY CONDUCTIVE A...
- Publication number 20210317343
- Publication date Oct 14, 2021
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...
- Publication number 20210189198
- Publication date Jun 24, 2021
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- B32 - LAYERED PRODUCTS
Information Patent Application
JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...
- Publication number 20210189197
- Publication date Jun 24, 2021
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- B32 - LAYERED PRODUCTS
Information Patent Application
JOINING FILM AND TAPE FOR WAFER PROCESSING
- Publication number 20190273062
- Publication date Sep 5, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Hidemichi FUJIWARA
- B32 - LAYERED PRODUCTS
Information Patent Application
JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...
- Publication number 20190264072
- Publication date Aug 29, 2019
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- B32 - LAYERED PRODUCTS

Norzafriza NITTA

Person

Patents Grantslast 30 patents

Metal particle-containing composition and electrically conductive a...

Patents Applicationslast 30 patents

BONDING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING BONDING MATE...

BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDE...

JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...

METAL PARTICLE-CONTAINING COMPOSITION AND ELECTRICALLY CONDUCTIVE A...

JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...

JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...

JOINING FILM AND TAPE FOR WAFER PROCESSING

JOINING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING JOINE...