TREA

Nour Eddine Derouiche

Follow

Person

  • Raleigh, NC, US
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Integrated circuit package assembly
    • Patent number 5,790,381
    • Issue date Aug 4, 1998
    • Mitsubishi Semiconductor America, Inc.
    • Nour Eddine Derouiche
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stacked dual in-line package assembly
    • Patent number 5,754,405
    • Issue date May 19, 1998
    • Mitsubishi Semiconductor America, Inc.
    • Nour Eddine Derouiche
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stackable double-density integrated circuit assemblies
    • Patent number 5,754,408
    • Issue date May 19, 1998
    • Mitsubishi Semiconductor America, Inc.
    • Nour Eddine Derouiche
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multiple device carrier
    • Patent number 5,664,681
    • Issue date Sep 9, 1997
    • Mitsubishi Semiconductor America, Inc.
    • Nour Eddine Derouiche
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Carriers for IC packages
    • Patent number 5,644,473
    • Issue date Jul 1, 1997
    • Mitsubishi Semiconductor America, Inc.
    • Nour Eddine Derouiche
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Integrated circuit package assembly
    • Patent number 5,623,395
    • Issue date Apr 22, 1997
    • Mitsubishi Semiconductor America, Inc.
    • Nour E. Derouiche
    • H01 - BASIC ELECTRIC ELEMENTS