Novy Sastrawati TJOKRO

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San Ramon, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Rapid flush purging during atomic layer deposition
- Patent number 12,060,639
- Issue date Aug 13, 2024
- Lam Research Corporation
- Pragna Nannapaneni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for wet metal seed deposition for bottom up gapfill of feat...
- Patent number 10,103,056
- Issue date Oct 16, 2018
- Lam Research Corporation
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching for enhanced bottom-up feature fill
- Patent number 9,837,312
- Issue date Dec 5, 2017
- Lam Research Corporation
- Samantha Tan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process to reduce nodule formation in electroless plating
- Patent number 9,142,416
- Issue date Sep 22, 2015
- Lam Research Corporation
- Nanhai Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via metallization
- Patent number 9,029,258
- Issue date May 12, 2015
- Lam Research Corporation
- Praveen Reddy Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous dielectrics K value restoration by thermal treatment and or...
- Patent number 8,603,913
- Issue date Dec 10, 2013
- Lam Research Corporation
- Nanhai Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL DEPOSITION
- Publication number 20220290300
- Publication date Sep 15, 2022
- LAM RESEARCH CORPORATION
- Ravi Vellanki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RAPID FLUSH PURGING DURING ATOMIC LAYER DEPOSITION
- Publication number 20220186370
- Publication date Jun 16, 2022
- LAM RESEARCH CORPORATION
- Pragna Nannapaneni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR WET METAL SEED DEPOSITION FOR BOTTOM UP GAPFILL OF FEAT...
- Publication number 20180261502
- Publication date Sep 13, 2018
- LAM RESEARCH CORPORATION
- Samantha Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA METALLIZATION
- Publication number 20140217590
- Publication date Aug 7, 2014
- LAM RESEARCH CORPORATION
- Praveen Reddy NALLA
- H01 - BASIC ELECTRIC ELEMENTS