Nozad Karim

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Shielded electronic component package
- Patent number 12,040,305
- Issue date Jul 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 11,646,290
- Issue date May 9, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 11,031,366
- Issue date Jun 8, 2021
- Amkor Technology Singapore Pte. Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 10,424,556
- Issue date Sep 24, 2019
- Amkor Technology, Inc.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield lid interconnect package and method
- Patent number 9,433,117
- Issue date Aug 30, 2016
- Amkor Technology, Inc.
- Jong Ok Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded trace structure and fabrication method
- Patent number 9,060,430
- Issue date Jun 16, 2015
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Top feature package and method
- Patent number 8,199,518
- Issue date Jun 12, 2012
- Amkor Technology, Inc.
- Jong Ok Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding for a semiconductor package
- Patent number 8,129,824
- Issue date Mar 6, 2012
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with increased I/O leadframe including passive...
- Patent number 8,072,050
- Issue date Dec 6, 2011
- Amkor Technology, Inc.
- Nozad O. Karim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded passive component network substrate fabrication method
- Patent number 7,958,626
- Issue date Jun 14, 2011
- Amkor Technology, Inc.
- Nozad Karim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method to provide RF shielding for a MEMS microphone pac...
- Patent number 7,915,715
- Issue date Mar 29, 2011
- Amkor Technology, Inc.
- Nozad O. Karim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for creating embedded metal features
- Patent number 7,911,037
- Issue date Mar 22, 2011
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded trace structure and fabrication method
- Patent number 7,832,097
- Issue date Nov 16, 2010
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded metal features structure
- Patent number 7,589,398
- Issue date Sep 15, 2009
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20230275061
- Publication date Aug 31, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20220052016
- Publication date Feb 17, 2022
- Amkor Technology Singapore Holding Pte. Ltd
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20190371760
- Publication date Dec 5, 2019
- Amkor Technology, Inc.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20160351525
- Publication date Dec 1, 2016
- Amkor Technology, Inc.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO PROVIDE RF SHIELDING FOR A MEMS MICROPHONE PAC...
- Publication number 20100127376
- Publication date May 27, 2010
- Nozad O. Karim
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Nozad Karim

Person

Patents Grantslast 30 patents

Shielded electronic component package

Shielded electronic component package

Shielded electronic component package

Shielded electronic component package

Shield lid interconnect package and method

Shielded trace structure and fabrication method

Top feature package and method

Shielding for a semiconductor package

Semiconductor device with increased I/O leadframe including passive...

Embedded passive component network substrate fabrication method

System and method to provide RF shielding for a MEMS microphone pac...

Method and structure for creating embedded metal features

Shielded trace structure and fabrication method

Embedded metal features structure

Patents Applicationslast 30 patents

SHIELDED ELECTRONIC COMPONENT PACKAGE

SHIELDED ELECTRONIC COMPONENT PACKAGE

SHIELDED ELECTRONIC COMPONENT PACKAGE

SHIELDED ELECTRONIC COMPONENT PACKAGE

SYSTEM AND METHOD TO PROVIDE RF SHIELDING FOR A MEMS MICROPHONE PAC...