Nozomi MATSUBARA

Person

Chiyoda-ku, Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Acrylic resin, producing method thereof, resin composition set, hea...
- Patent number 11,965,048
- Issue date Apr 23, 2024
- Resonac Corporation
- Naoki Furukawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition, heat storage material, and commodity
- Patent number 11,352,466
- Issue date Jun 7, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Naoki Furukawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITION CONTAINING (METH)ACRYLAMIDE COMPOUND AND COMPOUND HAVIN...
- Publication number 20240132646
- Publication date Apr 25, 2024
- Resonac Corporation
- Naoki FURUKAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITION CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN AND CO...
- Publication number 20240132645
- Publication date Apr 25, 2024
- Naoki FURUKAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047230
- Publication date Feb 8, 2024
- Resonac Corporation
- Tomoko HIGASHIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND SHEET
- Publication number 20240043597
- Publication date Feb 8, 2024
- Resonac Corporation
- Tomoko HIGASHIUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITION AND SHEET CONTAINING CURED PRODUCT OF SAME
- Publication number 20240043648
- Publication date Feb 8, 2024
- Tomoko HIGASHIUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE COMPOSITION SET AND ARTICLE
- Publication number 20230016868
- Publication date Jan 19, 2023
- Showa Denko Materials Co., Ltd.
- Nozomi MATSUBARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITION SET CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN
- Publication number 20220403082
- Publication date Dec 22, 2022
- Showa Denko Materials Co., Ltd.
- Nozomi MATSUBARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ACRYLIC RESIN, PRODUCING METHOD THEREOF, RESIN COMPOSITION SET, HEA...
- Publication number 20210301059
- Publication date Sep 30, 2021
- Showa Denko Materials Co., Ltd.
- Naoki FURUKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
- Publication number 20210261706
- Publication date Aug 26, 2021
- Showa Denko Materials Co., Ltd.
- Naoki FURUKAWA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
- Publication number 20210246349
- Publication date Aug 12, 2021
- Showa Denko Materials Co., Ltd.
- Naoki FURUKAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN MEMBER, METHOD FOR PRODUCING RESIN MEMBER AND HEAT STORAGE BODY
- Publication number 20210024803
- Publication date Jan 28, 2021
- Keiko KIZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND COMMODITY
- Publication number 20200165437
- Publication date May 28, 2020
- Hitachi Chemical Company, Ltd.
- Naoki FURUKAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Nozomi MATSUBARA

Person

Patents Grantslast 30 patents

Acrylic resin, producing method thereof, resin composition set, hea...

Resin composition, heat storage material, and commodity

Patents Applicationslast 30 patents

COMPOSITION CONTAINING (METH)ACRYLAMIDE COMPOUND AND COMPOUND HAVIN...

COMPOSITION CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN AND CO...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

COMPOSITION AND SHEET

COMPOSITION AND SHEET CONTAINING CURED PRODUCT OF SAME

CURABLE COMPOSITION SET AND ARTICLE

COMPOSITION SET CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN

ACRYLIC RESIN, PRODUCING METHOD THEREOF, RESIN COMPOSITION SET, HEA...

RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE

RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE

RESIN MEMBER, METHOD FOR PRODUCING RESIN MEMBER AND HEAT STORAGE BODY

RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND COMMODITY