Nozomu Nishimura

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component built-in module, electronic device including same, and me...
- Patent number 9,148,971
- Issue date Sep 29, 2015
- Lenovo Innovations Limited (Hong Kong)
- Nozomu Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in module, electronic device including same, and me...
- Patent number 9,036,359
- Issue date May 19, 2015
- LEONOVO INNOVATIONS LIMITED (HONG KONG)
- Nozomu Nishimura
- F21 - LIGHTING
Information Patent Grant
Circuit board device, wiring board interconnection method, and circ...
- Patent number 8,144,482
- Issue date Mar 27, 2012
- NEC Corporation
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board device, wiring board connecting method, and circuit b...
- Patent number 8,130,511
- Issue date Mar 6, 2012
- NEC Corporation
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BLAST FURNACE FAULT DETERMINATION APPARATUS, METHOD FOR DETERMINING...
- Publication number 20220163260
- Publication date May 26, 2022
- JFE STEEL CORPORATION
- Hiroyuki SHIMAMOTO
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Application
COMPONENT-CONTAINING MODULE AND METHOD FOR PRODUCING COMPONENT-CONT...
- Publication number 20140029208
- Publication date Jan 30, 2014
- NEC Corporation
- Nozomu Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND ME...
- Publication number 20130176746
- Publication date Jul 11, 2013
- NEC Corporation
- Nozomu Nishimura
- F21 - LIGHTING
Information Patent Application
COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND ME...
- Publication number 20130176689
- Publication date Jul 11, 2013
- NEC Corporation
- Nozomu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, LAYERED SUBSTRATE, AND METHODS OF MANUFACTURING...
- Publication number 20110001222
- Publication date Jan 6, 2011
- Nozomu Nishimura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit Board Device, Wiring Board Connecting Method, and Circuit B...
- Publication number 20090161331
- Publication date Jun 25, 2009
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board device, wiring board interconnection method, and circ...
- Publication number 20090135573
- Publication date May 28, 2009
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Nozomu Nishimura

Person

Patents Grantslast 30 patents

Component built-in module, electronic device including same, and me...

Component built-in module, electronic device including same, and me...

Circuit board device, wiring board interconnection method, and circ...

Circuit board device, wiring board connecting method, and circuit b...

Patents Applicationslast 30 patents

BLAST FURNACE FAULT DETERMINATION APPARATUS, METHOD FOR DETERMINING...

COMPONENT-CONTAINING MODULE AND METHOD FOR PRODUCING COMPONENT-CONT...

COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND ME...

COMPONENT BUILT-IN MODULE, ELECTRONIC DEVICE INCLUDING SAME, AND ME...

ELECTRONIC DEVICE, LAYERED SUBSTRATE, AND METHODS OF MANUFACTURING...

Circuit Board Device, Wiring Board Connecting Method, and Circuit B...

Circuit board device, wiring board interconnection method, and circ...