Nozomu Takano

Person

Ibaraki-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pregreg, film with resin, metal foil with resin, metal-clad laminat...
- Patent number 10,251,265
- Issue date Apr 2, 2019
- Hitachi Chemical Company, Ltd.
- Akiko Kawaguchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reflow film, solder bump formation method, solder joint formation m...
- Patent number 9,656,353
- Issue date May 23, 2017
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,664,534
- Issue date Mar 4, 2014
- Hitachi Chemical Company, Ltd.
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite, prepreg, laminated plate clad with metal foil, material...
- Patent number 8,440,285
- Issue date May 14, 2013
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- B32 - LAYERED PRODUCTS
Information Patent Grant
Prepreg for printed wiring board, metal foil clad laminate and prin...
- Patent number 7,947,332
- Issue date May 24, 2011
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thermosetting resin composition, resin film, metallic foil provided...
- Patent number 7,736,749
- Issue date Jun 15, 2010
- Hitachi Chemichal Co., Ltd.
- Hideo Baba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition, resin film, metallic foil provided...
- Patent number 7,166,361
- Issue date Jan 23, 2007
- Hitachi Chemical Co., Ltd.
- Hideo Baba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition with excellent dielectric characteristics, proces...
- Patent number 7,157,506
- Issue date Jan 2, 2007
- Hitachi Chemical Co., Ltd.
- Yasuyuki Mizuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and use thereof
- Patent number 7,078,106
- Issue date Jul 18, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and process for producing the same
- Patent number 6,787,614
- Issue date Sep 7, 2004
- Hitachi Chemical Co., Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Incombustible resin composition, prepreg, laminated plate, metal-cl...
- Patent number 6,706,409
- Issue date Mar 16, 2004
- Hitachi Chemical Co., Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg for printed wiring boards, resin varnish, resin composition...
- Patent number 6,696,155
- Issue date Feb 24, 2004
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg for printed wiring boards, resin varnish, resin composition...
- Patent number 6,692,792
- Issue date Feb 17, 2004
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition and use thereof
- Patent number 6,667,107
- Issue date Dec 23, 2003
- Hitachi Chemical Co., Ltd.
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of producing prepreg for printed wiring boards, glass fiber...
- Patent number 6,572,968
- Issue date Jun 3, 2003
- Hitachi Chemical Co., Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive-coated copper foil, and copper-clad laminate and printed c...
- Patent number 6,558,797
- Issue date May 6, 2003
- Hitachi Chemical Company, Ltd.
- Michitoshi Arata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg, metal-clad laminate, and printed circuit board obtained fr...
- Patent number 6,524,717
- Issue date Feb 25, 2003
- Hitachi Chemical Co., Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin compositions for printed circuit board and printed circ...
- Patent number 6,462,147
- Issue date Oct 8, 2002
- Hitachi Chemical Company, Ltd.
- Michitoshi Arata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formald...
- Patent number 6,329,474
- Issue date Dec 11, 2001
- Hitachi Chemical Company, Ltd.
- Michitoshi Arata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flame retardant epoxy resin composition for printed board, and prep...
- Patent number 6,214,468
- Issue date Apr 10, 2001
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Production of insulating varnishes and multilayer printed circuit b...
- Patent number 6,197,149
- Issue date Mar 6, 2001
- Hitachi Chemical Company, Ltd.
- Kazuhito Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Epoxy composition for printed circuit boards
- Patent number 6,180,250
- Issue date Jan 30, 2001
- Hitachi Chemical Co., Ltd.
- Michitoshi Arata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of producing high molecular weight epoxy resin using an amid...
- Patent number 5,391,687
- Issue date Feb 21, 1995
- Hitachi Chemical Company Ltd.
- Katsuji Shibata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of producing epoxy resin film
- Patent number 5,304,399
- Issue date Apr 19, 1994
- Hitachi Chemical Co., Ltd.
- Katsuji Shibata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin film and method of producing epoxy resin film
- Patent number 5,225,268
- Issue date Jul 6, 1993
- Hitachi Chemical Company, Ltd.
- Katsuji Shibata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVIC...
- Publication number 20240079345
- Publication date Mar 7, 2024
- Masashi OHKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENTS, AND SU...
- Publication number 20230397337
- Publication date Dec 7, 2023
- Hiroyuki IZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20230328897
- Publication date Oct 12, 2023
- Showa Denko Materials Co., Ltd.
- Hiroyuki IZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINAT...
- Publication number 20180098425
- Publication date Apr 5, 2018
- Akiko Kawaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...
- Publication number 20140252607
- Publication date Sep 11, 2014
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MULTI-LAYER WIRING BOARD
- Publication number 20120285732
- Publication date Nov 15, 2012
- Kazumasa TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINAT...
- Publication number 20110272185
- Publication date Nov 10, 2011
- Akiko Kawaguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20100270059
- Publication date Oct 28, 2010
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL, MATERIAL...
- Publication number 20100089626
- Publication date Apr 15, 2010
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTI-LAYER WIRING BOARD
- Publication number 20100065313
- Publication date Mar 18, 2010
- Kazumasa Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL, MATERIAL...
- Publication number 20090169808
- Publication date Jul 2, 2009
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Prin...
- Publication number 20070277375
- Publication date Dec 6, 2007
- Nozomu Takano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Resin composition excellent in dielectric properties, process for p...
- Publication number 20070207326
- Publication date Sep 6, 2007
- Yasuyuki Mizuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION, RESIN FILM, METALLIC FOIL PROVIDED...
- Publication number 20070037950
- Publication date Feb 15, 2007
- HITACHI CHEMICAL CO., Ltd.
- Hideo BABA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition of low thermal expansibility and re...
- Publication number 20050065275
- Publication date Mar 24, 2005
- HITACHI CHEMICAL CO., Ltd.
- Atsushi Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition and use thereof
- Publication number 20040091726
- Publication date May 13, 2004
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Prepreg for printed wiring boards, resin varnish, resin composition...
- Publication number 20030180536
- Publication date Sep 25, 2003
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for producing novel silicone polymer, silicone polymer prod...
- Publication number 20030171477
- Publication date Sep 11, 2003
- Hideo Baba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin composition with excellent dielectric characteristics, proces...
- Publication number 20030130412
- Publication date Jul 10, 2003
- Yasuyuki Mizuno
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Thermosetting resin composition and process for producing the same
- Publication number 20020193519
- Publication date Dec 19, 2002
- HITACHI CHEMICAL CO., Ltd.
- Nozomu Takano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermosetting resin composition and use thereof
- Publication number 20020147277
- Publication date Oct 10, 2002
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Incombustible resin composition, prepreg, laminated plate, metal-cl...
- Publication number 20020068173
- Publication date Jun 6, 2002
- HITACHI CHEMICAL CO., TLD
- Nozomu Takano
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of producing prepreg for printed wiring boards, glass fiber...
- Publication number 20010053447
- Publication date Dec 20, 2001
- Nozomu Takano
- C03 - GLASS MINERAL OR SLAG WOOL

Nozomu Takano

Person

Patents Grantslast 30 patents

Pregreg, film with resin, metal foil with resin, metal-clad laminat...

Reflow film, solder bump formation method, solder joint formation m...

Printed wiring board

Composite, prepreg, laminated plate clad with metal foil, material...

Prepreg for printed wiring board, metal foil clad laminate and prin...

Thermosetting resin composition, resin film, metallic foil provided...

Thermosetting resin composition, resin film, metallic foil provided...

Resin composition with excellent dielectric characteristics, proces...

Thermosetting resin composition and use thereof

Thermosetting resin composition and process for producing the same

Incombustible resin composition, prepreg, laminated plate, metal-cl...

Prepreg for printed wiring boards, resin varnish, resin composition...

Prepreg for printed wiring boards, resin varnish, resin composition...

Thermosetting resin composition and use thereof

Method of producing prepreg for printed wiring boards, glass fiber...

Adhesive-coated copper foil, and copper-clad laminate and printed c...

Prepreg, metal-clad laminate, and printed circuit board obtained fr...

Epoxy resin compositions for printed circuit board and printed circ...

Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formald...

Flame retardant epoxy resin composition for printed board, and prep...

Production of insulating varnishes and multilayer printed circuit b...

Epoxy composition for printed circuit boards

Method of producing high molecular weight epoxy resin using an amid...

Method of producing epoxy resin film

Epoxy resin film and method of producing epoxy resin film

Patents Applicationslast 30 patents

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

ELECTROCONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVIC...

METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENTS, AND SU...

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINAT...

REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...

MULTI-LAYER WIRING BOARD

PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINAT...

PRINTED WIRING BOARD

COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL, MATERIAL...

MULTI-LAYER WIRING BOARD

COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL, MATERIAL...

Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Prin...

Resin composition excellent in dielectric properties, process for p...

THERMOSETTING RESIN COMPOSITION, RESIN FILM, METALLIC FOIL PROVIDED...

Thermosetting resin composition of low thermal expansibility and re...

Thermosetting resin composition and use thereof

Prepreg for printed wiring boards, resin varnish, resin composition...

Process for producing novel silicone polymer, silicone polymer prod...

Resin composition with excellent dielectric characteristics, proces...

Thermosetting resin composition and process for producing the same

Thermosetting resin composition and use thereof

Incombustible resin composition, prepreg, laminated plate, metal-cl...

Method of producing prepreg for printed wiring boards, glass fiber...