Nurfarena OTHMAN

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe, semiconductor package including a leadframe and method f...
- Patent number 10,840,172
- Issue date Nov 17, 2020
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with air cavity
- Patent number 10,777,536
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Chau Fatt Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package having a filled conductive cavity
- Patent number 10,770,399
- Issue date Sep 8, 2020
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package Having a Filled Conductive Cavity
- Publication number 20200258842
- Publication date Aug 13, 2020
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Air Cavity
- Publication number 20190181120
- Publication date Jun 13, 2019
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME, SEMICONDUCTOR PACKAGE INCLUDING A LEADFRAME AND METHOD F...
- Publication number 20180233438
- Publication date Aug 16, 2018
- INFINEON TECHNOLOGIES AG
- Thomas BEMMERL
- H01 - BASIC ELECTRIC ELEMENTS