Nurwati Suwendi Devnani

Person

Fort Collins, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
System and method for using a reference plane to control transmissi...
- Patent number 9,166,550
- Issue date Oct 20, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Nurwati Suwendi Devnani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate interconnect having a coaxial via structure
- Patent number 9,041,208
- Issue date May 26, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Adam Gallegos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit transmission lines, methods for designing integr...
- Patent number 7,855,614
- Issue date Dec 21, 2010
- Avago Technologies ECBU IP (Singapore) Pte Ltd
- Minh Van Quach
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System, device and method for reducing cross-talk in differential s...
- Patent number 7,609,125
- Issue date Oct 27, 2009
- Avago Technologies Enterprise IP (Singapore) Pte. Ltd.
- Minh van Quach
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package
- Patent number 7,227,254
- Issue date Jun 5, 2007
- Agilent Technologies, Inc.
- Nurwati S Devnani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of manufacturing an integrated circui...
- Patent number 7,001,834
- Issue date Feb 21, 2006
- Agilent Technologies, Inc.
- Nurwati S Devnani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-performance laminate for integrated circuit interconnection
- Patent number 6,630,628
- Issue date Oct 7, 2003
- Agilent Technologies, Inc.
- Nurwati S Devnani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
System And Method For Using A Reference Plane To Control Transmissi...
- Publication number 20140266491
- Publication date Sep 18, 2014
- Avago Technologies General IP (Singapore) PTE. LTD.
- Nurwati Suwendi Devnani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE INTERCONNECT HAVING A COAXIAL VIA STRUCTURE
- Publication number 20130105987
- Publication date May 2, 2013
- Avago Technologies Enterprise IP (Singapore) Pte. Ltd.
- Adam Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Transmission Lines, Methods for Designing Integr...
- Publication number 20090284324
- Publication date Nov 19, 2009
- AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD
- Minh Van Quach
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anti Pad To Reduce Parasitic Capacitance And Improve Return Loss In...
- Publication number 20080237893
- Publication date Oct 2, 2008
- Minh Van Quach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, device and method for reducing cross-talk in differential s...
- Publication number 20080088007
- Publication date Apr 17, 2008
- Minh van Quach
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit and method of manufacturing an integrated circui...
- Publication number 20050121766
- Publication date Jun 9, 2005
- Nurwati S. Devnani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit and method of manufacturing an integrated circui...
- Publication number 20040084768
- Publication date May 6, 2004
- Nurwati S. Devnani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUI...
- Publication number 20030183919
- Publication date Oct 2, 2003
- Nurwati S. Devnani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PERFORMANCE LAMINATE FOR INTEGRATED CIRCUIT INTERCONNECTION
- Publication number 20030148077
- Publication date Aug 7, 2003
- Nurwati S. Devnani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Nurwati Suwendi Devnani

Person

Patents Grantslast 30 patents

System and method for using a reference plane to control transmissi...

Laminate interconnect having a coaxial via structure

Integrated circuit transmission lines, methods for designing integr...

System, device and method for reducing cross-talk in differential s...

Integrated circuit package

Integrated circuit and method of manufacturing an integrated circui...

High-performance laminate for integrated circuit interconnection

Patents Applicationslast 30 patents

System And Method For Using A Reference Plane To Control Transmissi...

LAMINATE INTERCONNECT HAVING A COAXIAL VIA STRUCTURE

Integrated Circuit Transmission Lines, Methods for Designing Integr...

Anti Pad To Reduce Parasitic Capacitance And Improve Return Loss In...

System, device and method for reducing cross-talk in differential s...

Integrated circuit and method of manufacturing an integrated circui...

Integrated circuit and method of manufacturing an integrated circui...

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUI...

HIGH-PERFORMANCE LAMINATE FOR INTEGRATED CIRCUIT INTERCONNECTION