Nyles I. Nettleton

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Ramp-stack chip package with variable chip spacing
- Patent number 9,082,632
- Issue date Jul 14, 2015
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Base plate for use in a multi-chip module
- Patent number 8,164,917
- Issue date Apr 24, 2012
- Oracle America, Inc.
- Jing Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR STACKING WARPED CHIPS TO ASSEMBLE THREE-DI...
- Publication number 20200357772
- Publication date Nov 12, 2020
- ORACLE INTERNATIONAL CORPORATION
- Yue Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STACKING WARPED CHIPS TO ASSEMBLE THREE-DI...
- Publication number 20190279962
- Publication date Sep 12, 2019
- ORACLE INTERNATIONAL CORPORATION
- Yue Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAMP-STACK CHIP PACKAGE WITH VARIABLE CHIP SPACING
- Publication number 20130299977
- Publication date Nov 14, 2013
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE PLATE FOR USE IN A MULTI-CHIP MODULE
- Publication number 20110149539
- Publication date Jun 23, 2011
- SUN MICROSYSTEMS, INC.
- Jing Shi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...