Octavio Trovarelli

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical through contact
- Patent number 8,124,521
- Issue date Feb 28, 2012
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying solder to redistribution lines
- Patent number 7,906,421
- Issue date Mar 15, 2011
- Qimonda AG
- Octavio Trovarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing layer structures for signal distribution
- Patent number 7,393,782
- Issue date Jul 1, 2008
- Infineon Technologies AG
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a rewiring printed circuit board
- Patent number 7,390,742
- Issue date Jun 24, 2008
- Infineon Technologies AG
- Axel Brintzinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with compliant elevations having electrical co...
- Patent number 7,368,375
- Issue date May 6, 2008
- Infineon Technologies AG
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving the mechanical properties of BOC module arrang...
- Patent number 7,332,430
- Issue date Feb 19, 2008
- Infineon Technologies AG
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing metallic interconnects and contact surfaces o...
- Patent number 7,271,095
- Issue date Sep 18, 2007
- Infineon Technologies AG
- Axel Brintzinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement and process for protecting fuses/anti-fuses
- Patent number 7,235,859
- Issue date Jun 26, 2007
- Infineon Technologies AG
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating metallic interconnects on electronic components
- Patent number 7,172,966
- Issue date Feb 6, 2007
- Infineon Technologies AG
- Axel Brintzinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection between a semiconductor chip and an external conductor s...
- Patent number 7,169,647
- Issue date Jan 30, 2007
- Infineon Technologies AG
- Octavio Trovarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting the redistribution layer on wafers/chips
- Patent number 7,115,496
- Issue date Oct 3, 2006
- Infineon Technologies AG
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL THROUGH CONTACT
- Publication number 20080029850
- Publication date Feb 7, 2008
- Qimonda AG
- Harry Hedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Applying Solder to Redistribution Lines
- Publication number 20070298602
- Publication date Dec 27, 2007
- Octavio Trovarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for attaching dice to a package and arrangement of dice in a...
- Publication number 20060270104
- Publication date Nov 30, 2006
- Octavio Trovarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a rewiring printed circuit board
- Publication number 20060121257
- Publication date Jun 8, 2006
- Axel Brintzinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for producing a chip arrangement provided with a molding co...
- Publication number 20050277230
- Publication date Dec 15, 2005
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement for reducing the electrical crosstalk on a chip
- Publication number 20050275085
- Publication date Dec 15, 2005
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement and process for protecting fuses/anti-fuses
- Publication number 20050258506
- Publication date Nov 24, 2005
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing layer structures for signal distribution
- Publication number 20050191837
- Publication date Sep 1, 2005
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing metallic interconnects and contact surfaces o...
- Publication number 20050186772
- Publication date Aug 25, 2005
- Axel Brintzinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating metallic interconnects on electronic components
- Publication number 20050186786
- Publication date Aug 25, 2005
- Axel Brintzinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component with compliant elevations having electrical co...
- Publication number 20050127521
- Publication date Jun 16, 2005
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving the mechanical properties of BOC module arrang...
- Publication number 20040259290
- Publication date Dec 23, 2004
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection between a semiconductor chip and an external conductor s...
- Publication number 20040248341
- Publication date Dec 9, 2004
- Octavio Trovarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for protecting the redistribution layer on wafers/chips
- Publication number 20040248343
- Publication date Dec 9, 2004
- Axel Brintzinger
- H01 - BASIC ELECTRIC ELEMENTS

Octavio Trovarelli

Person

Patents Grantslast 30 patents

Electrical through contact

Method for applying solder to redistribution lines

Process for producing layer structures for signal distribution

Method for producing a rewiring printed circuit board

Electronic component with compliant elevations having electrical co...

Method for improving the mechanical properties of BOC module arrang...

Process for producing metallic interconnects and contact surfaces o...

Arrangement and process for protecting fuses/anti-fuses

Method for fabricating metallic interconnects on electronic components

Connection between a semiconductor chip and an external conductor s...

Method for protecting the redistribution layer on wafers/chips

Patents Applicationslast 30 patents

ELECTRICAL THROUGH CONTACT

Method for Applying Solder to Redistribution Lines

Method for attaching dice to a package and arrangement of dice in a...

Method for producing a rewiring printed circuit board

Process for producing a chip arrangement provided with a molding co...

Arrangement for reducing the electrical crosstalk on a chip

Arrangement and process for protecting fuses/anti-fuses

Process for producing layer structures for signal distribution

Process for producing metallic interconnects and contact surfaces o...

Method for fabricating metallic interconnects on electronic components

Electronic component with compliant elevations having electrical co...

Method for improving the mechanical properties of BOC module arrang...

Connection between a semiconductor chip and an external conductor s...

Method for protecting the redistribution layer on wafers/chips