Oh Han Kim

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Icheon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Mock bump system for flip chip integrated circuits
- Patent number 8,633,586
- Issue date Jan 21, 2014
- Stats Chippac Ltd.
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip interconnection system having solder position control mec...
- Patent number 8,604,624
- Issue date Dec 10, 2013
- Stats Chippac Ltd.
- Oh Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked integrated circuit package system
- Patent number 7,956,449
- Issue date Jun 7, 2011
- Stats Chippac Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20090321907
- Publication date Dec 31, 2009
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOCK BUMP SYSTEM FOR FLIP CHIP INTEGRATED CIRCUITS
- Publication number 20090243091
- Publication date Oct 1, 2009
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP INTERCONNECTION SYSTEM
- Publication number 20090236756
- Publication date Sep 24, 2009
- Oh Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR