Oh Sug Kim

Person

Ichon-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with substrate mold gate and me...
- Patent number 8,859,342
- Issue date Oct 14, 2014
- Stats Chippac Ltd.
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with underfill and method of ma...
- Patent number 8,748,233
- Issue date Jun 10, 2014
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system with vertical intermetallic compound
- Patent number 8,709,934
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- BaeYong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with trenches and method of man...
- Patent number 8,536,718
- Issue date Sep 17, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with routable underlayer and me...
- Patent number 8,513,057
- Issue date Aug 20, 2013
- Stats Chippac Ltd.
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with stack interconnect and met...
- Patent number 8,466,567
- Issue date Jun 18, 2013
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with underfill and method of ma...
- Patent number 8,409,923
- Issue date Apr 2, 2013
- Stats Chippac Ltd.
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for semiconductor package with flow controller
- Patent number 8,129,231
- Issue date Mar 6, 2012
- Stats Chippac, Inc.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with flow controller
- Patent number 7,612,444
- Issue date Nov 3, 2009
- Stats Chippac, Inc.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE MOLD GATE AND ME...
- Publication number 20130154079
- Publication date Jun 20, 2013
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE UNDERLAYER AND ME...
- Publication number 20130069224
- Publication date Mar 21, 2013
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MA...
- Publication number 20120326291
- Publication date Dec 27, 2012
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MA...
- Publication number 20120319300
- Publication date Dec 20, 2012
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACK INTERCONNECT AND MET...
- Publication number 20120068319
- Publication date Mar 22, 2012
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRENCHES AND METHOD OF MAN...
- Publication number 20110316162
- Publication date Dec 29, 2011
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURE FOR SEMICONDUCTOR PACKAGE WITH FLOW CONTROLLER
- Publication number 20100009468
- Publication date Jan 14, 2010
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM WITH VERTICAL INTERMETALLIC COMPOUND
- Publication number 20080303142
- Publication date Dec 11, 2008
- BaeYong Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM WITH DIE CARRIER HAVING MOLD FLOW REST...
- Publication number 20080164618
- Publication date Jul 10, 2008
- STATS ChipPAC, Inc.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit packaging system with substrate mold gate and me...

Integrated circuit packaging system with underfill and method of ma...

Electronic system with vertical intermetallic compound

Integrated circuit packaging system with trenches and method of man...

Integrated circuit packaging system with routable underlayer and me...

Integrated circuit packaging system with stack interconnect and met...

Integrated circuit packaging system with underfill and method of ma...

Method of manufacture for semiconductor package with flow controller

Semiconductor package with flow controller

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE MOLD GATE AND ME...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTABLE UNDERLAYER AND ME...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACK INTERCONNECT AND MET...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TRENCHES AND METHOD OF MAN...

METHOD OF MANUFACTURE FOR SEMICONDUCTOR PACKAGE WITH FLOW CONTROLLER

ELECTRONIC SYSTEM WITH VERTICAL INTERMETALLIC COMPOUND

SEMICONDUCTOR PACKAGE SYSTEM WITH DIE CARRIER HAVING MOLD FLOW REST...