Ohguk KWON

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,990,452
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and semiconductor package including the same
- Patent number 11,887,913
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,735,566
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Ohguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,710,757
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Ohguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,626,385
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package with underfill and image sensor module includi...
- Patent number 11,545,512
- Issue date Jan 3, 2023
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and semiconductor package including the same
- Patent number 11,545,417
- Issue date Jan 3, 2023
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240055403
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Changeun Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230215842
- Publication date Jul 6, 2023
- NAMHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE
- Publication number 20230187380
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- CHANGEUN JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230117072
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220157780
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Ohguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220052097
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- Ohguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE WITH UNDERFILL AND IMAGE SENSOR MODULE INCLUDI...
- Publication number 20220045111
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220013501
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Namhoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210407890
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package

Integrated circuit device and semiconductor package including the same

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package

Image sensor package with underfill and image sensor module includi...

Integrated circuit device and semiconductor package including the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE

INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

IMAGE SENSOR PACKAGE WITH UNDERFILL AND IMAGE SENSOR MODULE INCLUDI...

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME