OhHan Kim

Person

Kyonggi-Do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
- Patent number 11,932,933
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
- Patent number 11,434,561
- Issue date Sep 6, 2022
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of forming an integrated SiP module...
- Patent number 11,367,690
- Issue date Jun 21, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protrusion e-bar for 3D SiP
- Patent number 11,342,294
- Issue date May 24, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming SIP module over film layer
- Patent number 11,309,193
- Issue date Apr 19, 2022
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming SIP module over film layer
- Patent number 10,804,119
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,797,039
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an integrated SIP module...
- Patent number 10,700,011
- Issue date Jun 30, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protrusion E-bar for 3D SIP
- Patent number 10,636,756
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming SIP with electrical comp...
- Patent number 10,629,565
- Issue date Apr 21, 2020
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming SIP with electrical comp...
- Patent number 10,418,341
- Issue date Sep 17, 2019
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,388,637
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device and method of forming a low profile dual-purpo...
- Patent number 10,163,744
- Issue date Dec 25, 2018
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming holes in substrate to in...
- Patent number 9,543,258
- Issue date Jan 10, 2017
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming topside and bottom-side...
- Patent number 9,478,486
- Issue date Oct 25, 2016
- STATS ChipPAC Pte. Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure w...
- Patent number 9,373,578
- Issue date Jun 21, 2016
- STATS ChipPAC Pte. Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming holes in substrate to in...
- Patent number 9,293,349
- Issue date Mar 22, 2016
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of calibrating warpage testing syst...
- Patent number 9,279,673
- Issue date Mar 8, 2016
- STATS ChipPAC, Ltd.
- WonJun Ko
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device and method of forming shielding layer grounded...
- Patent number 9,123,663
- Issue date Sep 1, 2015
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming topside and bottom-side...
- Patent number 8,900,921
- Issue date Dec 2, 2014
- STATS ChipPAC, Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bump formed on substrate to prevent ELK I...
- Patent number 8,884,339
- Issue date Nov 11, 2014
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a thermally reinforced s...
- Patent number 8,786,076
- Issue date Jul 22, 2014
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure w...
- Patent number 8,709,935
- Issue date Apr 29, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming WLCSP structure using pr...
- Patent number 8,519,544
- Issue date Aug 27, 2013
- STATS Chip PAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bump formed on substrate to prevent...
- Patent number 8,519,536
- Issue date Aug 27, 2013
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure w...
- Patent number 8,409,979
- Issue date Apr 2, 2013
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor method of forming bump on substrate to prevent ELK IL...
- Patent number 8,367,467
- Issue date Feb 5, 2013
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming WLCSP structure using pr...
- Patent number 8,273,604
- Issue date Sep 25, 2012
- STAT ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming holes in substrate to in...
- Patent number 8,264,059
- Issue date Sep 11, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
- Publication number 20240183026
- Publication date Jun 6, 2024
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
- Publication number 20220364222
- Publication date Nov 17, 2022
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
- Publication number 20210301390
- Publication date Sep 30, 2021
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming SIP Module Over Film Layer
- Publication number 20200402817
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-i...
- Publication number 20200373289
- Publication date Nov 26, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Integrated SIP Module...
- Publication number 20200286835
- Publication date Sep 10, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
- Publication number 20200219835
- Publication date Jul 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
- Publication number 20200013738
- Publication date Jan 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming SIP with Electrical Comp...
- Publication number 20190355695
- Publication date Nov 21, 2019
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming SIP Module Over Film Layer
- Publication number 20180269195
- Publication date Sep 20, 2018
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-i...
- Publication number 20180261569
- Publication date Sep 13, 2018
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Integrated SIP Module...
- Publication number 20180158779
- Publication date Jun 7, 2018
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-I...
- Publication number 20180158768
- Publication date Jun 7, 2018
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming SIP with Electrical Comp...
- Publication number 20180061806
- Publication date Mar 1, 2018
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Holes in Substrate to In...
- Publication number 20160148882
- Publication date May 26, 2016
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Calibrating Warpage Testing Syst...
- Publication number 20140269810
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- WonJun Ko
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Method of Forming Topside and Bottom-side...
- Publication number 20140239509
- Publication date Aug 28, 2014
- STATS ChipPAC, Ltd.
- Sun Mi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure w...
- Publication number 20140175642
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump on Substrate to Pre...
- Publication number 20130264705
- Publication date Oct 10, 2013
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure w...
- Publication number 20130154090
- Publication date Jun 20, 2013
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump on Substrate to Pre...
- Publication number 20130087913
- Publication date Apr 11, 2013
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Low Profile Dual-Purpo...
- Publication number 20130056862
- Publication date Mar 7, 2013
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming TIM Within Recesses of M...
- Publication number 20130049188
- Publication date Feb 28, 2013
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming WLCSP Structure using Pr...
- Publication number 20120306097
- Publication date Dec 6, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure W...
- Publication number 20120306104
- Publication date Dec 6, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Holes in Substrate to In...
- Publication number 20120292751
- Publication date Nov 22, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Thermally Reinforced S...
- Publication number 20120241941
- Publication date Sep 27, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming WLCSP Structure Using Pr...
- Publication number 20120211892
- Publication date Aug 23, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Semiconductor Device and Method of Forming Top-Side an...
- Publication number 20120153452
- Publication date Jun 21, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump on Substrate to Pre...
- Publication number 20110260316
- Publication date Oct 27, 2011
- STATS ChipPAC, Ltd.
- KiYoun Jang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Cooling device and process for cooling double-sided SiP devices dur...

Semiconductor device and method of forming a 3D interposer system-i...

Cooling device and process for cooling double-sided SiP devices dur...

Semiconductor device and method of forming an integrated SiP module...

Semiconductor device and method of forming protrusion e-bar for 3D SiP

Semiconductor device and method of forming SIP module over film layer

Method of forming SIP module over film layer

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor device and method of forming an integrated SIP module...

Semiconductor device and method of forming protrusion E-bar for 3D SIP

Semiconductor device and method of forming SIP with electrical comp...

Semiconductor device and method of forming SIP with electrical comp...

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor device and method of forming a low profile dual-purpo...

Semiconductor device and method of forming holes in substrate to in...

Semiconductor device and method of forming topside and bottom-side...

Semiconductor device and method of forming interconnect structure w...

Semiconductor device and method of forming holes in substrate to in...

Semiconductor device and method of calibrating warpage testing syst...

Semiconductor device and method of forming shielding layer grounded...

Semiconductor device and method of forming topside and bottom-side...

Semiconductor device with bump formed on substrate to prevent ELK I...

Semiconductor device and method of forming a thermally reinforced s...

Semiconductor device and method of forming interconnect structure w...

Semiconductor device and method of forming WLCSP structure using pr...

Semiconductor device including bump formed on substrate to prevent...

Semiconductor device and method of forming interconnect structure w...

Semiconductor method of forming bump on substrate to prevent ELK IL...

Semiconductor device and method of forming WLCSP structure using pr...

Semiconductor device and method of forming holes in substrate to in...

Patents Applicationslast 30 patents

Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...

Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...

Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...

Semiconductor Device and Method of Forming SIP Module Over Film Layer

Semiconductor Device and Method of Forming a 3D Interposer System-i...

Semiconductor Device and Method of Forming an Integrated SIP Module...

Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP

Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP

Semiconductor Device and Method of Forming SIP with Electrical Comp...

Semiconductor Device and Method of Forming SIP Module Over Film Layer

Semiconductor Device and Method of Forming a 3D Interposer System-i...

Semiconductor Device and Method of Forming an Integrated SIP Module...

Semiconductor Device and Method of Forming a 3D Interposer System-I...

Semiconductor Device and Method of Forming SIP with Electrical Comp...

Semiconductor Device and Method of Forming Holes in Substrate to In...

Semiconductor Device and Method of Calibrating Warpage Testing Syst...

Semiconductor Device and Method of Forming Topside and Bottom-side...

Semiconductor Device and Method of Forming Interconnect Structure w...

Semiconductor Device and Method of Forming Bump on Substrate to Pre...

Semiconductor Device and Method of Forming Interconnect Structure w...

Semiconductor Device and Method of Forming Bump on Substrate to Pre...

Semiconductor Device and Method of Forming a Low Profile Dual-Purpo...

Semiconductor Device and Method of Forming TIM Within Recesses of M...

Semiconductor Device and Method of Forming WLCSP Structure using Pr...

Semiconductor Device and Method of Forming Interconnect Structure W...

Semiconductor Device and Method of Forming Holes in Substrate to In...

Semiconductor Device and Method of Forming a Thermally Reinforced S...

Semiconductor Device and Method of Forming WLCSP Structure Using Pr...

Double-Sided Semiconductor Device and Method of Forming Top-Side an...

Semiconductor Device and Method of Forming Bump on Substrate to Pre...