OhSug Kim

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AnYang-Si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Stacked integrated circuit package-in-package system and method of...
- Patent number 8,617,924
- Issue date Dec 31, 2013
- Stats Chippac Ltd.
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with top pad
- Patent number 8,089,166
- Issue date Jan 3, 2012
- Stats Chippac Ltd.
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system with cavity substrate
- Patent number 7,968,371
- Issue date Jun 28, 2011
- Stats Chippac Ltd.
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with down-set die pad and method...
- Patent number 7,833,840
- Issue date Nov 16, 2010
- Stats Chippac Ltd.
- Byung Hoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,635,913
- Issue date Dec 22, 2009
- Stats Chippac Ltd.
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM AND METHOD OF...
- Publication number 20100044849
- Publication date Feb 25, 2010
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH TOP PAD
- Publication number 20080157401
- Publication date Jul 3, 2008
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20080136007
- Publication date Jun 12, 2008
- STATS ChipPAC Ltd.
- OhSug Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DOWN-SET DIE PAD
- Publication number 20080032456
- Publication date Feb 7, 2008
- STATS ChipPAC Ltd.
- Byung Hoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS