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Ok Byung Kim
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Suwon-City, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing printed circuit board
Patent number
8,881,381
Issue date
Nov 11, 2014
Samsung Electro-Mechanics Co., Ltd.
Mi Sun Hwang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing a printed circuit board having metal bumps
Patent number
8,464,423
Issue date
Jun 18, 2013
Samsung Electro-Mechanics Co., Ltd.
Myung Sam Kang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing a printed circuit board having metal bumps
Patent number
8,141,241
Issue date
Mar 27, 2012
Samsung Electro-Mechanics Co., Ltd.
Myung Sam Kang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PRINTED CIRCUIT BOARD HAVING METAL BUMPS
Publication number
20160242284
Publication date
Aug 18, 2016
Samsung Electro-Mechanics Co., Ltd.
Myung Sam KANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD HAVING METAL BUMPS
Publication number
20140202748
Publication date
Jul 24, 2014
Samsung Electro-Mechanics Co., Ltd.
Myung Sam KANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
Publication number
20140090245
Publication date
Apr 3, 2014
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Mi Sun HWANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printed circuit board having metal bumps
Publication number
20120061132
Publication date
Mar 15, 2012
Samsung Electro-Mechanics Co., Ltd.
Myung Sam Kang
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method of manufacturing a printed circuit board having metal bumps
Publication number
20120060365
Publication date
Mar 15, 2012
Samsung Electro-Mechanics Co., Ltd.
Myung Sam Kang
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Method of fabricating printed circuit board
Publication number
20110067233
Publication date
Mar 24, 2011
Samsung Electro-Mechanics Co., Ltd.
Seon Ha Kang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
Publication number
20110061231
Publication date
Mar 17, 2011
Mi Sun HWANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printed circuit board and manufacturing method thereof
Publication number
20110061912
Publication date
Mar 17, 2011
Samsung Electro-Mechanics Co., Ltd.
Myung Sam Kang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AN...
Publication number
20100314755
Publication date
Dec 16, 2010
Myung Sam KANG
B32 - LAYERED PRODUCTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Publication number
20100193232
Publication date
Aug 5, 2010
Myung Sam Kang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printed circuit board having metal bump and method of manufacring t...
Publication number
20100132985
Publication date
Jun 3, 2010
Samsung Electro-Mechanics Co., Ltd.
Myung Sam Kang
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Display device having superior characteristics
Publication number
20040085268
Publication date
May 6, 2004
Samsung SDI Co., Ltd.
Ok Byung Kim
H01 - BASIC ELECTRIC ELEMENTS