Okgyeong Park

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages including molding layers
- Patent number 8,922,024
- Issue date Dec 30, 2014
- Samsung Electronics Co., Ltd.
- Minok Na
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046755
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACIAL MATERIAL PATTERNS
- Publication number 20250029886
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING STIFFENER STRUCTURE
- Publication number 20240413096
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- OKGYEONG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240321753
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Okgyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
- Publication number 20240324094
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Okgyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240222309
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Okgyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING MOLDING LAYERS
- Publication number 20130292848
- Publication date Nov 7, 2013
- Samsung Electronics Co., Ltd.
- Minok NA
- H01 - BASIC ELECTRIC ELEMENTS

Okgyeong Park

Person

Patents Grantslast 30 patents

Semiconductor packages including molding layers

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACIAL MATERIAL PATTERNS

SEMICONDUCTOR PACKAGE COMPRISING STIFFENER STRUCTURE

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES INCLUDING MOLDING LAYERS