Olaf Hohlfeld

Person

Warstein, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Power module with metal substrate
- Patent number 12,002,724
- Issue date Jun 4, 2024
- Infineon Technologies Austria AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,978,700
- Issue date May 7, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor arrangement
- Patent number 11,955,450
- Issue date Apr 9, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for producing the same
- Patent number 11,688,712
- Issue date Jun 27, 2023
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for fabricating the same
- Patent number 11,610,830
- Issue date Mar 21, 2023
- Infineon Technologies AG
- Christian Schweikert
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing power semiconductor module arrangement
- Patent number 11,557,522
- Issue date Jan 17, 2023
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for producing the same
- Patent number 11,437,311
- Issue date Sep 6, 2022
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with metal substrate
- Patent number 11,404,336
- Issue date Aug 2, 2022
- Infineon Technologies Austria AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a direct copper bonded substrate...
- Patent number 11,322,451
- Issue date May 3, 2022
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,081,414
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for producing the same
- Patent number 10,867,902
- Issue date Dec 15, 2020
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising a transistor chip module and a dri...
- Patent number 10,242,969
- Issue date Mar 26, 2019
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a direct copper bonded substrate...
- Patent number 10,211,158
- Issue date Feb 19, 2019
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a power semiconductor module
- Patent number 10,096,584
- Issue date Oct 9, 2018
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package having a dielectric layer and an encapsulant
- Patent number 10,043,782
- Issue date Aug 7, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a number of chip assemblies and method for pro...
- Patent number 9,984,928
- Issue date May 29, 2018
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assemblage, press pack cell and method for operating a press p...
- Patent number 9,972,596
- Issue date May 15, 2018
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, method for producing a number of chip as...
- Patent number 9,818,730
- Issue date Nov 14, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a composite and a power semiconductor module
- Patent number 9,688,060
- Issue date Jun 27, 2017
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a circuit carrier arrangement having a carrier...
- Patent number 9,640,511
- Issue date May 2, 2017
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, semiconductor module arrangement and method f...
- Patent number 9,627,356
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, method for producing a semiconductor mod...
- Patent number 9,620,459
- Issue date Apr 11, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module comprising printed circuit board and method fo...
- Patent number 9,609,748
- Issue date Mar 28, 2017
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spring contact for semiconductor chip
- Patent number 9,595,502
- Issue date Mar 14, 2017
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, method for producing a number of chip as...
- Patent number 9,589,859
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, method for producing a semiconductor mod...
- Patent number 9,559,065
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly comprising chip arrays
- Patent number 9,524,951
- Issue date Dec 20, 2016
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Explosion-protected semiconductor module
- Patent number 9,214,432
- Issue date Dec 15, 2015
- Infineon Technologies AG
- Guido Boenig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising two semiconductor modules and late...
- Patent number 9,196,510
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and a method for fabrication thereof by extend...
- Patent number 9,064,869
- Issue date Jun 23, 2015
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20230275059
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20220359365
- Publication date Nov 10, 2022
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module With Metal Substrate
- Publication number 20220310465
- Publication date Sep 29, 2022
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module with Metal Substrate
- Publication number 20210407873
- Publication date Dec 30, 2021
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Substrate
- Publication number 20210398821
- Publication date Dec 23, 2021
- Fabian Craes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING POWER SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20210335682
- Publication date Oct 28, 2021
- INFINEON TECHNOLOGIES AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module and Method for Producing the Same
- Publication number 20210074624
- Publication date Mar 11, 2021
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Method for Fabricating the Same
- Publication number 20200321262
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Christian Schweikert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement and Method for Producing the Same
- Publication number 20200266171
- Publication date Aug 20, 2020
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Arrangement, Substrate Arrangement, and...
- Publication number 20200083138
- Publication date Mar 12, 2020
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Arrangement and Method for Producing the...
- Publication number 20190237372
- Publication date Aug 1, 2019
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Having a Direct Copper Bonded Substrate...
- Publication number 20190221521
- Publication date Jul 18, 2019
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module and Method for Producing the Same
- Publication number 20190189553
- Publication date Jun 20, 2019
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
An Electronic Device Package
- Publication number 20180350780
- Publication date Dec 6, 2018
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device Package Having a Dielectric Layer and an Encapsulant
- Publication number 20170287880
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Power Semiconductor Module
- Publication number 20170125395
- Publication date May 4, 2017
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Number of Chip Assemblies and Method for Pro...
- Publication number 20170098580
- Publication date Apr 6, 2017
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module, Semiconductor Module Arrangement and Method f...
- Publication number 20160365333
- Publication date Dec 15, 2016
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Circuit Carrier Arrangement Having a Carrier...
- Publication number 20160284664
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLAGE, PRESS PACK CELL AND METHOD FOR OPERATING A PRESS P...
- Publication number 20160126212
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Having a Direct Copper Bonded Substrate...
- Publication number 20160126192
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP
- Publication number 20160126211
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING CHIP ARRAYS
- Publication number 20150287698
- Publication date Oct 8, 2015
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Comprising a Transistor Chip Module and a Dri...
- Publication number 20150130071
- Publication date May 14, 2015
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Comprising Two Semiconductor Modules and Late...
- Publication number 20150130048
- Publication date May 14, 2015
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module Comprising Printed Circuit Board and Method fo...
- Publication number 20150092380
- Publication date Apr 2, 2015
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Explosion-Protected Semiconductor Module
- Publication number 20150091148
- Publication date Apr 2, 2015
- INFINEON TECHNOLOGIES AG
- Guido Boenig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement, Method for Producing a Semiconductor Mod...
- Publication number 20150061144
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement, Method for Producing a Number of Chip As...
- Publication number 20150061100
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement, Method for Producing a Number of Chip As...
- Publication number 20150054166
- Publication date Feb 26, 2015
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS

Olaf Hohlfeld

Person

Patents Grantslast 30 patents

Power module with metal substrate

Power semiconductor module arrangement

Method for producing a semiconductor arrangement

Semiconductor arrangement and method for producing the same

Power semiconductor module and method for fabricating the same

Method for producing power semiconductor module arrangement

Semiconductor module and method for producing the same

Power module with metal substrate

Power semiconductor module having a direct copper bonded substrate...

Power semiconductor module arrangement

Semiconductor module and method for producing the same

Semiconductor package comprising a transistor chip module and a dri...

Power semiconductor module having a direct copper bonded substrate...

Method for producing a power semiconductor module

Electronic device package having a dielectric layer and an encapsulant

Method for producing a number of chip assemblies and method for pro...

Chip assemblage, press pack cell and method for operating a press p...

Semiconductor arrangement, method for producing a number of chip as...

Method for producing a composite and a power semiconductor module

Method for producing a circuit carrier arrangement having a carrier...

Semiconductor module, semiconductor module arrangement and method f...

Semiconductor arrangement, method for producing a semiconductor mod...

Semiconductor module comprising printed circuit board and method fo...

Spring contact for semiconductor chip

Semiconductor arrangement, method for producing a number of chip as...

Semiconductor arrangement, method for producing a semiconductor mod...

Semiconductor assembly comprising chip arrays

Explosion-protected semiconductor module

Semiconductor package comprising two semiconductor modules and late...

Semiconductor module and a method for fabrication thereof by extend...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT

POWER SEMICONDUCTOR MODULE ARRANGEMENT

Power Module With Metal Substrate

Power Module with Metal Substrate

Method for Producing a Substrate

METHOD FOR PRODUCING POWER SEMICONDUCTOR MODULE ARRANGEMENT

Semiconductor Module and Method for Producing the Same

Power Semiconductor Module and Method for Fabricating the Same

Semiconductor Arrangement and Method for Producing the Same

Power Semiconductor Module Arrangement, Substrate Arrangement, and...

Power Semiconductor Module Arrangement and Method for Producing the...

Power Semiconductor Module Having a Direct Copper Bonded Substrate...

Semiconductor Module and Method for Producing the Same

An Electronic Device Package

Electronic Device Package Having a Dielectric Layer and an Encapsulant

Method for Producing a Power Semiconductor Module

Method for Producing a Number of Chip Assemblies and Method for Pro...

Semiconductor Module, Semiconductor Module Arrangement and Method f...

Method for Producing a Circuit Carrier Arrangement Having a Carrier...

CHIP ASSEMBLAGE, PRESS PACK CELL AND METHOD FOR OPERATING A PRESS P...

Power Semiconductor Module Having a Direct Copper Bonded Substrate...

SEMICONDUCTOR ARRANGEMENT, METHOD FOR PRODUCING A SEMICONDUCTOR CHIP

SEMICONDUCTOR ASSEMBLY COMPRISING CHIP ARRAYS

Semiconductor Package Comprising a Transistor Chip Module and a Dri...

Semiconductor Package Comprising Two Semiconductor Modules and Late...

Semiconductor Module Comprising Printed Circuit Board and Method fo...

Explosion-Protected Semiconductor Module

Semiconductor Arrangement, Method for Producing a Semiconductor Mod...

Semiconductor Arrangement, Method for Producing a Number of Chip As...

Semiconductor Arrangement, Method for Producing a Number of Chip As...