Olaf ZSCHIESCHANG

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Vaterstetten, DE

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Patents Grantslast 30 patents

Information Patent Grant
Power module housing
- Patent number 11,081,828
- Issue date Aug 3, 2021
- Semiconductor Components Industries, LLC
- Jihwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit pin case
- Patent number D922329
- Issue date Jun 15, 2021
- Semiconductor Components Industries, LLC
- Jihwan Kim
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,037,907
- Issue date Jun 15, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 10,403,601
- Issue date Sep 3, 2019
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module to protect against short circuit event
- Patent number 10,304,788
- Issue date May 28, 2019
- Semiconductor Components Industries, LLC
- Jihwan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLIES WITH EMBEDDED SEMICONDUCTOR DEVICE MODULES AND RELATED M...
- Publication number 20240128197
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Olaf ZSCHIESCHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CIRCUIT MODULE
- Publication number 20230052830
- Publication date Feb 16, 2023
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20210265318
- Publication date Aug 26, 2021
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HOUSING
- Publication number 20200358221
- Publication date Nov 12, 2020
- Semiconductor Components Industries, LLC
- Jihwan KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190348399
- Publication date Nov 14, 2019
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20170365583
- Publication date Dec 21, 2017
- FAIRCHILD SEMICONDUCTOR CORPORATION
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS