Oleh B. Dutkewych

Person

  • Harvard, MA, US

Patents Grantslast 30 patents

  • Information Patent Grant

    Seed layer deposition

    • Patent number 6,824,665
    • Issue date Nov 30, 2004
    • Shipley Company, L.L.C.
    • James G. Shelnut
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Catalytic metal of reduced particle size

    • Patent number 4,725,314
    • Issue date Feb 16, 1988
    • Shipley Company Inc.
    • Michael Gulla
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Ductile electroless copper

    • Patent number 4,695,505
    • Issue date Sep 22, 1987
    • Shipley Company Inc.
    • Oleh B. Dutkewych
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Catalytic metal of reduced particle size

    • Patent number 4,652,311
    • Issue date Mar 24, 1987
    • Shipley Company Inc.
    • Michael Gulla
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Catalytic metal of reduced particle size

    • Patent number 4,634,468
    • Issue date Jan 6, 1987
    • Shipley Company Inc.
    • Michael Gulla
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroless alloy plating

    • Patent number 4,482,596
    • Issue date Nov 13, 1984
    • Shipley Company Inc.
    • Michael Gulla
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Etchant and process

    • Patent number 4,144,119
    • Issue date Mar 13, 1979
    • Oleh B. Dutkewych
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Etchant and process of etching with the same

    • Patent number 4,130,454
    • Issue date Dec 19, 1978
    • Oleh B. Dutkewych
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    Seed layer deposition

    • Publication number 20020066671
    • Publication date Jun 6, 2002
    • Shipley Company, L.L.C.
    • James G. Shelnut
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...