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Oliver Genz
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Dresden, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Method for production of a semiconductor structure
Patent number
7,141,507
Issue date
Nov 28, 2006
Infineon Technologies AG
Oliver Genz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for introducing structures which have different dimensions i...
Patent number
7,049,228
Issue date
May 23, 2006
Infineon Technologies AG
Ulrich Baier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a contact hole plane in a memory module
Patent number
7,018,781
Issue date
Mar 28, 2006
Infineon Technologies, AG
Hans-Georg Fröhlich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for removing carbon-containing polysilane from a semiconduct...
Patent number
6,740,594
Issue date
May 25, 2004
Infineon Technologies AG
Zhijian Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process flow for two-step collar in DRAM preparation
Patent number
6,670,235
Issue date
Dec 30, 2003
Infineon Technologies AG
Helmut Horst Tews
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method for production of a semiconductor structure
Publication number
20050196952
Publication date
Sep 8, 2005
Infineon Technologies AG
Oliver Genz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for fabricating a contact hole plane in a memory module
Publication number
20050003308
Publication date
Jan 6, 2005
Infineon Technologies AG
Hans-Georg Frohlich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for introducing structures which have different dimensions i...
Publication number
20040192031
Publication date
Sep 30, 2004
Ulrich Baier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for removing polysilane from a semiconductor without stripping
Publication number
20020182871
Publication date
Dec 5, 2002
Zhijian Lu
H01 - BASIC ELECTRIC ELEMENTS