Oliver Hellmund

Person

Neubiberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having semiconductor device elements in a semi...
- Patent number 12,107,130
- Issue date Oct 1, 2024
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an electrical contact with a metal l...
- Patent number 11,552,048
- Issue date Jan 10, 2023
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding compound and semiconductor package with a molding compound
- Patent number 11,069,626
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method
- Patent number 11,038,028
- Issue date Jun 15, 2021
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with backside metal structures and methods of formation the...
- Patent number 11,011,409
- Issue date May 18, 2021
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch device
- Patent number 10,707,865
- Issue date Jul 7, 2020
- Infineon Technologies Austria AG
- Anton Mauder
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Forming silicon oxide layers by radical oxidation and semiconductor...
- Patent number 10,566,426
- Issue date Feb 18, 2020
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation of semiconductor device with buried cavity
- Patent number 10,553,675
- Issue date Feb 4, 2020
- Infineon Technologies AG
- Sebastian Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with backside metal structures and methods of formation the...
- Patent number 10,535,553
- Issue date Jan 14, 2020
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a porous conductive structure in connection to...
- Patent number 10,373,868
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer thinning and realizing backside metal structures
- Patent number 10,325,804
- Issue date Jun 18, 2019
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithically integrated chip including active electrical componen...
- Patent number 10,199,372
- Issue date Feb 5, 2019
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device comprising a support...
- Patent number 10,199,332
- Issue date Feb 5, 2019
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a semiconductor device and semiconductor devices
- Patent number 10,177,033
- Issue date Jan 8, 2019
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch device
- Patent number 10,158,356
- Issue date Dec 18, 2018
- Infineon Technologies Austria AG
- Anton Mauder
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing semiconductor devices with transistor cells...
- Patent number 10,121,859
- Issue date Nov 6, 2018
- Infineon Technologies AG
- Ravi Keshav Joshi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and methods for forming a plurality of semicon...
- Patent number 10,074,566
- Issue date Sep 11, 2018
- Infineon Technologies AG
- Johannes Baumgartl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with backside metal structures and methods of formation the...
- Patent number 9,960,076
- Issue date May 1, 2018
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with buried isolation layers and methods of formation th...
- Patent number 9,875,926
- Issue date Jan 23, 2018
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure
- Patent number 9,761,548
- Issue date Sep 12, 2017
- Infineon Technologies AG
- Peter Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a composite material, associated composite mat...
- Patent number 8,922,016
- Issue date Dec 30, 2014
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a composite material, associated composite mat...
- Patent number 8,025,783
- Issue date Sep 27, 2011
- Infineon Technologies AG
- Oliver Hellmund
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A HYBRID DEVICE
- Publication number 20220238751
- Publication date Jul 28, 2022
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR DEVICE ELEMENTS IN A SEMI...
- Publication number 20210265468
- Publication date Aug 26, 2021
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ELECTRICAL CONTACT WITH A METAL L...
- Publication number 20210167036
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Oliver HELLMUND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices with Backside Metal Structures and Methods of Formation The...
- Publication number 20200098617
- Publication date Mar 26, 2020
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method
- Publication number 20190348506
- Publication date Nov 14, 2019
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Compound and Semiconductor Package with a Molding Compound
- Publication number 20190318996
- Publication date Oct 17, 2019
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Switch Device
- Publication number 20190074831
- Publication date Mar 7, 2019
- Infineon Technologies Austria AG
- Anton Mauder
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MONOLITHICALLY INTEGRATED CHIP INCLUDING ACTIVE ELECTRICAL COMPONEN...
- Publication number 20180374843
- Publication date Dec 27, 2018
- INFINEON TECHNOLOGIES AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices with Backside Metal Structures and Methods of Formation The...
- Publication number 20180233399
- Publication date Aug 16, 2018
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SILICON OXIDE LAYERS BY RADICAL OXIDATION AND SEMICONDUCTOR...
- Publication number 20180175150
- Publication date Jun 21, 2018
- INFINEON TECHNOLOGIES AG
- Anton MAUDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SEMICONDUCTOR D...
- Publication number 20180144982
- Publication date May 24, 2018
- INFINEON TECHNOLOGIES AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Wafer Thinning and Realizing Backside Metal Structures
- Publication number 20180144974
- Publication date May 24, 2018
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Including Buried Cavity and Manufacturing Method
- Publication number 20180108675
- Publication date Apr 19, 2018
- INFINEON TECHNOLOGIES AG
- Sebastian Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Switch Device
- Publication number 20180069544
- Publication date Mar 8, 2018
- Infineon Technologies Austria AG
- Anton Mauder
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Devices with Backside Metal Structures and Methods of Formation The...
- Publication number 20180040504
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming a Semiconductor Device and Semiconductor Devices
- Publication number 20170365516
- Publication date Dec 21, 2017
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods for Forming a Plurality of Semicon...
- Publication number 20170338153
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Johannes Baumgartl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device Comprising a Support...
- Publication number 20170323858
- Publication date Nov 9, 2017
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Devices with Transistor Cells...
- Publication number 20170271446
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Ravi Keshav Joshi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE
- Publication number 20170207123
- Publication date Jul 20, 2017
- Infineon Technologies Austria AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrates with Buried Isolation Layers and Methods of Formation Th...
- Publication number 20170154808
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURING OVER TOPOGRAPHY
- Publication number 20170031239
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Sebastian SCHMIDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Composite Material, Associated Composite Mat...
- Publication number 20110304047
- Publication date Dec 15, 2011
- INFINEON TECHNOLOGIES AG
- Oliver HELLMUND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Composite Material, Associated Composite Mat...
- Publication number 20080067630
- Publication date Mar 20, 2008
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS

Oliver Hellmund

Person

Patents Grantslast 30 patents

Semiconductor device having semiconductor device elements in a semi...

Semiconductor device including an electrical contact with a metal l...

Molding compound and semiconductor package with a molding compound

Semiconductor device and manufacturing method

Devices with backside metal structures and methods of formation the...

Switch device

Forming silicon oxide layers by radical oxidation and semiconductor...

Isolation of semiconductor device with buried cavity

Devices with backside metal structures and methods of formation the...

Method of processing a porous conductive structure in connection to...

Method of wafer thinning and realizing backside metal structures

Monolithically integrated chip including active electrical componen...

Method of manufacturing a semiconductor device comprising a support...

Methods for forming a semiconductor device and semiconductor devices

Switch device

Method of manufacturing semiconductor devices with transistor cells...

Semiconductor device and methods for forming a plurality of semicon...

Devices with backside metal structures and methods of formation the...

Substrates with buried isolation layers and methods of formation th...

Bond pad structure

Method for producing a composite material, associated composite mat...

Method for producing a composite material, associated composite mat...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A HYBRID DEVICE

SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR DEVICE ELEMENTS IN A SEMI...

SEMICONDUCTOR DEVICE INCLUDING AN ELECTRICAL CONTACT WITH A METAL L...

Devices with Backside Metal Structures and Methods of Formation The...

Semiconductor Device and Manufacturing Method

Molding Compound and Semiconductor Package with a Molding Compound

Switch Device

MONOLITHICALLY INTEGRATED CHIP INCLUDING ACTIVE ELECTRICAL COMPONEN...

Devices with Backside Metal Structures and Methods of Formation The...

FORMING SILICON OXIDE LAYERS BY RADICAL OXIDATION AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SEMICONDUCTOR D...

Method of Wafer Thinning and Realizing Backside Metal Structures

Integrated Circuit Including Buried Cavity and Manufacturing Method

Switch Device

Devices with Backside Metal Structures and Methods of Formation The...

Methods for Forming a Semiconductor Device and Semiconductor Devices

Semiconductor Device and Methods for Forming a Plurality of Semicon...

Method of Manufacturing a Semiconductor Device Comprising a Support...

Method of Manufacturing Semiconductor Devices with Transistor Cells...

METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE

Substrates with Buried Isolation Layers and Methods of Formation Th...

STRUCTURING OVER TOPOGRAPHY

Method for Producing a Composite Material, Associated Composite Mat...

Method for Producing a Composite Material, Associated Composite Mat...