Oliver Humbel

Person

Maria Elend, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,363,961
- Issue date Jul 15, 2025
- Infineon Technologies AG
- Carsten Schaeffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 12,183,696
- Issue date Dec 31, 2024
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with first and second portions that include si...
- Patent number 11,804,415
- Issue date Oct 31, 2023
- Infineon Technologies AG
- Markus Kahn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device including bonding pad metal layer structure
- Patent number 11,764,176
- Issue date Sep 19, 2023
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ppower semiconductor device with anticorrosive edge termination str...
- Patent number 11,387,359
- Issue date Jul 12, 2022
- Infineon Technologies AG
- Oliver Humbel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a portion including silicon and nitrogen...
- Patent number 11,075,134
- Issue date Jul 27, 2021
- Infineon Technologies AG
- Markus Kahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device having a metal adhesion and ba...
- Patent number 10,777,506
- Issue date Sep 15, 2020
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metal adhesion and barrier structure...
- Patent number 10,475,743
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer
- Patent number 9,859,395
- Issue date Jan 2, 2018
- Infineon Technologies AG
- Gerhard Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a semiconductor device
- Patent number 9,418,850
- Issue date Aug 16, 2016
- Infineon Technologies AG
- Oliver Humbel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a corrosion-resistant metallization and...
- Patent number 9,355,958
- Issue date May 31, 2016
- Infineon Technologies AG
- Carsten Schäffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjusting the charge carrier lifetime in a bipolar semiconductor de...
- Patent number 9,349,799
- Issue date May 24, 2016
- Infineon Technologies AG
- Gerhard Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer
- Patent number 8,884,342
- Issue date Nov 11, 2014
- Infineon Technologies AG
- Gerhard Schmidt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF
- Publication number 20240194779
- Publication date Jun 13, 2024
- Infineon Technologies Austria AG
- Christian Zmölnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20230395539
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Semiconductor Device with Step Topography Passivation...
- Publication number 20230343726
- Publication date Oct 26, 2023
- INFINEON TECHNOLOGIES AG
- Angelika Koprowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230154978
- Publication date May 18, 2023
- INFINEON TECHNOLOGIES AG
- Carsten SCHAEFFER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including Bonding Pad Metal Layer Structure
- Publication number 20220059477
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIRST AND SECOND PORTIONS THAT INCLUDE SI...
- Publication number 20210287954
- Publication date Sep 16, 2021
- Markus Kahn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High Voltage Semiconductor Device with Step Topography Passivation...
- Publication number 20210151391
- Publication date May 20, 2021
- INFINEON TECHNOLOGIES AG
- Angelika Koprowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device
- Publication number 20200194585
- Publication date Jun 18, 2020
- Oliver Humbel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with a Portion Including Silicon and Nitrogen...
- Publication number 20200083133
- Publication date Mar 12, 2020
- Markus Kahn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Silicon Carbide Semiconductor Device Having a Metal Adhesion and Ba...
- Publication number 20200013722
- Publication date Jan 9, 2020
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing
- Publication number 20190333765
- Publication date Oct 31, 2019
- Markus Kahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Metal Adhesion and Barrier Structure...
- Publication number 20170271268
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Frank Hille
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming a Semiconductor Device
- Publication number 20160111289
- Publication date Apr 21, 2016
- INFINEON TECHNOLOGIES AG
- Oliver Humbel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adjusting the Charge Carrier Lifetime in a Bipolar Semiconductor De...
- Publication number 20160049474
- Publication date Feb 18, 2016
- Infineon Technologies AG
- Gerhard Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE,POWER ELECTRONIC MODULE, AND METHOD FOR...
- Publication number 20150262814
- Publication date Sep 17, 2015
- INFINEON TECHNOLOGIES AG
- Mathias Plappert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Corrosion-Resistant Metallization and...
- Publication number 20150115449
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Carsten Schäffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with a Passivation Layer
- Publication number 20150056788
- Publication date Feb 26, 2015
- INFINEON TECHNOLOGIES AG
- Gerhard Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with a Passivation Layer
- Publication number 20140061733
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Gerhard Schmidt
- H01 - BASIC ELECTRIC ELEMENTS

Oliver Humbel

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device including bonding pad metal layer structure

Semiconductor device with first and second portions that include si...

Semiconductor device including bonding pad metal layer structure

Ppower semiconductor device with anticorrosive edge termination str...

Semiconductor device with a portion including silicon and nitrogen...

Silicon carbide semiconductor device having a metal adhesion and ba...

Semiconductor device having a metal adhesion and barrier structure...

Semiconductor device with a passivation layer

Semiconductor device and method for forming a semiconductor device

Semiconductor device having a corrosion-resistant metallization and...

Adjusting the charge carrier lifetime in a bipolar semiconductor de...

Semiconductor device with a passivation layer

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THEREOF

Semiconductor Device Including Bonding Pad Metal Layer Structure

High Voltage Semiconductor Device with Step Topography Passivation...

SEMICONDUCTOR DEVICE

Semiconductor Device Including Bonding Pad Metal Layer Structure

SEMICONDUCTOR DEVICE WITH FIRST AND SECOND PORTIONS THAT INCLUDE SI...

High Voltage Semiconductor Device with Step Topography Passivation...

Power Semiconductor Device

Semiconductor Device with a Portion Including Silicon and Nitrogen...

Silicon Carbide Semiconductor Device Having a Metal Adhesion and Ba...

Semiconductor Device and Manufacturing

Semiconductor Device Having a Metal Adhesion and Barrier Structure...

Semiconductor Device and Method for Forming a Semiconductor Device

Adjusting the Charge Carrier Lifetime in a Bipolar Semiconductor De...

POWER SEMICONDUCTOR DEVICE,POWER ELECTRONIC MODULE, AND METHOD FOR...

Semiconductor Device Having a Corrosion-Resistant Metallization and...

Semiconductor Device with a Passivation Layer

Semiconductor Device with a Passivation Layer