Oliver Kierse

Person

Killaloe, IE

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 12,027,472
- Issue date Jul 2, 2024
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages to minimize stress on a semiconductor die
- Patent number 11,616,027
- Issue date Mar 28, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas sensor packages
- Patent number 10,730,743
- Issue date Aug 4, 2020
- Analog Devices Global Unlimited Company
- Oliver J. Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Localized strain relief for an integrated circuit
- Patent number 10,461,151
- Issue date Oct 29, 2019
- Analog Devices Global
- Patrick F. M. Poucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress shield for integrated circuit package
- Patent number 9,786,609
- Issue date Oct 10, 2017
- Analog Devices Global
- Oliver J Kierse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods for packaging
- Patent number 9,661,408
- Issue date May 23, 2017
- Analog Devices, Inc.
- Oliver J. Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Localized strain relief for an integrated circuit
- Patent number 9,466,666
- Issue date Oct 11, 2016
- Analog Devices Global
- Patrick F. M. Poucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages and methods for packaging
- Patent number 9,156,680
- Issue date Oct 13, 2015
- Analog Devices, Inc.
- Oliver J. Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging and methods for packaging
- Patent number 8,890,301
- Issue date Nov 18, 2014
- Analog Devices, Inc.
- Oliver J. Kierse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control aperture for an IR sensor
- Patent number 8,766,186
- Issue date Jul 1, 2014
- Analog Devices, Inc.
- Oliver Kierse
- G01 - MEASURING TESTING
Information Patent Grant
Radiation sensor device and method
- Patent number 8,476,591
- Issue date Jul 2, 2013
- Analog Devices, Inc.
- Oliver Kierse
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit package with enlarged die paddle
- Patent number 8,193,620
- Issue date Jun 5, 2012
- Analog Devices, Inc.
- John Alberghini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level CSP packaging concept
- Patent number 7,939,916
- Issue date May 10, 2011
- Analog Devices, Inc.
- Alan O'Donnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed capacitive sensor
- Patent number 7,938,014
- Issue date May 10, 2011
- Analog Devices, Inc.
- Peter G. Meehan
- G01 - MEASURING TESTING
Information Patent Grant
Radiation sensor device and method
- Patent number 7,897,920
- Issue date Mar 1, 2011
- Analog Devices, Inc.
- Oliver Kierse
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level CSP sensor
- Patent number 7,880,244
- Issue date Feb 1, 2011
- Analog Devices, Inc.
- Oliver Kierse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spaced, bumped component structure
- Patent number 7,667,323
- Issue date Feb 23, 2010
- Analog Devices, Inc.
- Oliver Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive sensor and method of fabricating
- Patent number 7,401,523
- Issue date Jul 22, 2008
- Analog Devices, Inc.
- Peter G. Meehan
- G01 - MEASURING TESTING
Information Patent Grant
Die size-increasing integrated circuit leads and thermally enhanced...
- Patent number 6,225,683
- Issue date May 1, 2001
- Analog Devices, Inc.
- Prasad V. V. Yalamanchili
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally efficient integrated circuit package
- Patent number 5,796,159
- Issue date Aug 18, 1998
- Analog Devices, Inc.
- Oliver J. Kierse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with improved heat dissipation
- Patent number 5,541,446
- Issue date Jul 30, 1996
- Analog Devices, Inc.
- Oliver J. Kierse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMF shielding of an integrated circuit package
- Patent number 5,486,720
- Issue date Jan 23, 1996
- Analog Devices, Inc.
- Oliver J. Kierse
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20240304569
- Publication date Sep 12, 2024
- Analong Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan et al.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20230207489
- Publication date Jun 29, 2023
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20210183790
- Publication date Jun 17, 2021
- Analog Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SENSOR PACKAGES
- Publication number 20190135614
- Publication date May 9, 2019
- Analog Devices Global Unlimited Company
- Oliver J. Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20170257687
- Publication date Sep 7, 2017
- Analog Devices, Inc.
- Oliver J. Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOCALIZED STRAIN RELIEF FOR AN INTEGRATED CIRCUIT
- Publication number 20170025497
- Publication date Jan 26, 2017
- ANALOG DEVICES GLOBAL
- Patrick F.M. Poucher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20160105737
- Publication date Apr 14, 2016
- Analog Devices, Inc.
- Oliver J. Kierse
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STRESS SHIELD FOR INTEGRATED CIRCUIT PACKAGE
- Publication number 20150123256
- Publication date May 7, 2015
- Analog Devices Technology
- Oliver J Kierse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20140117473
- Publication date May 1, 2014
- Analog Devices, Inc.
- Oliver J. Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING AND METHODS FOR PACKAGING
- Publication number 20140035113
- Publication date Feb 6, 2014
- Analog Devices, Inc.
- Oliver J. Kierse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED STRAIN RELIEF FOR AN INTEGRATED CIRCUIT
- Publication number 20130292793
- Publication date Nov 7, 2013
- Analog Devices Technology
- Patrick F. M. POUCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package with Enlarged Die Paddle
- Publication number 20110198741
- Publication date Aug 18, 2011
- Analog Devices, Inc.
- John Alberghini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer Level CSP Sensor
- Publication number 20090256216
- Publication date Oct 15, 2009
- Analog Devices, Inc.
- Oliver Kierse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiation sensor device and method
- Publication number 20090218492
- Publication date Sep 3, 2009
- Oliver Kierse
- G01 - MEASURING TESTING
Information Patent Application
Sealed capacitive sensor
- Publication number 20080210013
- Publication date Sep 4, 2008
- Peter G. Meehan
- G01 - MEASURING TESTING
Information Patent Application
Wafer Level CSP Packaging Concept
- Publication number 20080179730
- Publication date Jul 31, 2008
- Analog Devices, Inc.
- Alan O'Donnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Control aperture for an IR sensor
- Publication number 20080164415
- Publication date Jul 10, 2008
- Oliver Kierse
- G01 - MEASURING TESTING
Information Patent Application
Radiation sensor device and method
- Publication number 20070063145
- Publication date Mar 22, 2007
- Oliver Kierse
- G01 - MEASURING TESTING
Information Patent Application
Capacitive sensor and method of fabricating
- Publication number 20060191350
- Publication date Aug 31, 2006
- Peter G. Meehan
- G01 - MEASURING TESTING
Information Patent Application
Sealed capacitive sensor
- Publication number 20060191351
- Publication date Aug 31, 2006
- Peter G. Meehan
- G01 - MEASURING TESTING
Information Patent Application
Spaced, bumped component structure
- Publication number 20060163726
- Publication date Jul 27, 2006
- Oliver Kierse
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Oliver Kierse

Person

Patents Grantslast 30 patents

Integrated circuit packages to minimize stress on a semiconductor die

Integrated circuit packages to minimize stress on a semiconductor die

Gas sensor packages

Localized strain relief for an integrated circuit

Stress shield for integrated circuit package

Packages and methods for packaging

Localized strain relief for an integrated circuit

Packages and methods for packaging

Packaging and methods for packaging

Control aperture for an IR sensor

Radiation sensor device and method

Integrated circuit package with enlarged die paddle

Wafer level CSP packaging concept

Sealed capacitive sensor

Radiation sensor device and method

Wafer level CSP sensor

Spaced, bumped component structure

Capacitive sensor and method of fabricating

Die size-increasing integrated circuit leads and thermally enhanced...

Thermally efficient integrated circuit package

Integrated circuit package with improved heat dissipation

EMF shielding of an integrated circuit package

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

GAS SENSOR PACKAGES

PACKAGES AND METHODS FOR PACKAGING

LOCALIZED STRAIN RELIEF FOR AN INTEGRATED CIRCUIT

PACKAGES AND METHODS FOR PACKAGING

STRESS SHIELD FOR INTEGRATED CIRCUIT PACKAGE

PACKAGES AND METHODS FOR PACKAGING

PACKAGING AND METHODS FOR PACKAGING

LOCALIZED STRAIN RELIEF FOR AN INTEGRATED CIRCUIT

Integrated Circuit Package with Enlarged Die Paddle

Wafer Level CSP Sensor

Radiation sensor device and method

Sealed capacitive sensor

Wafer Level CSP Packaging Concept

Control aperture for an IR sensor

Radiation sensor device and method

Capacitive sensor and method of fabricating

Sealed capacitive sensor

Spaced, bumped component structure