Olivier Franiatte

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Saint Egreve, FR

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Patents Grantslast 30 patents

Information Patent Grant
Cap for package of integrated circuit
- Patent number 11,923,256
- Issue date Mar 5, 2024
- STMicroelectronics (Grenoble 2) SAS
- Olivier Franiatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap for package of integrated circuit
- Patent number 11,101,188
- Issue date Aug 24, 2021
- STMicroelectronics (Grenoble 2) SAS
- Olivier Franiatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling an optical system with an optical package in a...
- Patent number 7,018,112
- Issue date Mar 28, 2006
- STMicroelectronics S.A.
- Olivier Franiatte
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SUPPORT SUBSTRATE FOR INTEGRATED CIRCUIT, ELECTRONIC DEVICE, AND CO...
- Publication number 20210391227
- Publication date Dec 16, 2021
- STMicroelectronics (Grenoble 2) SAS
- Richard REMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAP FOR PACKAGE OF INTEGRATED CIRCUIT
- Publication number 20210343609
- Publication date Nov 4, 2021
- STMicroelectronics (Grenoble 2) SAS
- Olivier Franiatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING OF ELECTRONIC DEVICES
- Publication number 20200312735
- Publication date Oct 1, 2020
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAP FOR PACKAGE OF INTEGRATED CIRCUIT
- Publication number 20200075436
- Publication date Mar 5, 2020
- STMicroelectronics (Grenoble 2) SAS
- Olivier Franiatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling an optical system with an optical package in a...
- Publication number 20040218876
- Publication date Nov 4, 2004
- STMicroelectronics S.A.
- Olivier Franiatte
- H04 - ELECTRIC COMMUNICATION TECHNIQUE