Olivier MANN

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 12,071,702
- Issue date Aug 27, 2024
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal or metal alloy deposition composition and plating compound
- Patent number 11,512,405
- Issue date Nov 29, 2022
- Atotech Deutschland GmbH
- Angela Llavona-Serrano
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Imidazoyl urea polymers and their use in metal or metal alloy plati...
- Patent number 11,066,553
- Issue date Jul 20, 2021
- Atotech Deutschland GmbH
- Heiko Brunner
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 11,035,051
- Issue date Jun 15, 2021
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Aqueous copper plating baths and a method for deposition of copper...
- Patent number 10,767,275
- Issue date Sep 8, 2020
- Atotech Deutschland GmbH
- Heiko Brunner
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Copper electroplating method
- Patent number 9,963,797
- Issue date May 8, 2018
- Atotech Deutschland GmbH
- Andreas Macioβek
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper plating bath composition
- Patent number 9,551,080
- Issue date Jan 24, 2017
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING
- Publication number 20210262105
- Publication date Aug 26, 2021
- Atotech Deutschland GmbH
- Kun SI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL OR METAL ALLOY DEPOSITION COMPOSITION AND PLATING COMPOUND
- Publication number 20200340132
- Publication date Oct 29, 2020
- Angela LLAVONA-SERRANO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING
- Publication number 20190203369
- Publication date Jul 4, 2019
- Atotech Deutschland GmbH
- Kun SI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
IMIDAZOYL UREA POLYMERS AND THEIR USE IN METAL OR METAL ALLOY PLATI...
- Publication number 20190144667
- Publication date May 16, 2019
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AQUEOUS COPPER PLATING BATHS AND A METHOD FOR DEPOSITION OF COPPER...
- Publication number 20180223442
- Publication date Aug 9, 2018
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTROPLATING METHOD
- Publication number 20160258077
- Publication date Sep 8, 2016
- Atotech Deutschland GmbH
- Andreas MACIOßEK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER PLATING BATH COMPOSITION
- Publication number 20150299883
- Publication date Oct 22, 2015
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Olivier MANN

Person

Patents Grantslast 30 patents

Acidic aqueous composition for electrolytic copper plating

Metal or metal alloy deposition composition and plating compound

Imidazoyl urea polymers and their use in metal or metal alloy plati...

Acidic aqueous composition for electrolytic copper plating

Aqueous copper plating baths and a method for deposition of copper...

Copper electroplating method

Copper plating bath composition

Patents Applicationslast 30 patents

ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING

METAL OR METAL ALLOY DEPOSITION COMPOSITION AND PLATING COMPOUND

ACIDIC AQUEOUS COMPOSITION FOR ELECTROLYTIC COPPER PLATING

IMIDAZOYL UREA POLYMERS AND THEIR USE IN METAL OR METAL ALLOY PLATI...

AQUEOUS COPPER PLATING BATHS AND A METHOD FOR DEPOSITION OF COPPER...

COPPER ELECTROPLATING METHOD

COPPER PLATING BATH COMPOSITION