Omkar Karhade

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical multichip package with multiple system-on-chip dies
- Patent number 12,148,744
- Issue date Nov 19, 2024
- Intel Corporation
- Zhichao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 12,119,326
- Issue date Oct 15, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 12,113,023
- Issue date Oct 8, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch on interposer architecture for low cost optical co-packaging
- Patent number 12,061,371
- Issue date Aug 13, 2024
- Intel Corporation
- Xiaoqian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon groove architectures and manufacturing processes for passiv...
- Patent number 12,044,888
- Issue date Jul 23, 2024
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
Information Patent Grant
Open cavity bridge power delivery architectures and processes
- Patent number 12,027,448
- Issue date Jul 2, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package 3D antenna
- Patent number 12,003,023
- Issue date Jun 4, 2024
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,923,307
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,887,962
- Issue date Jan 30, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
- Patent number 11,854,945
- Issue date Dec 26, 2023
- Tahoe Research, LTD.
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,804,441
- Issue date Oct 31, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond and leadframe magnetic inductors
- Patent number 11,804,456
- Issue date Oct 31, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor package including a bridge die disposed in...
- Patent number 11,791,274
- Issue date Oct 17, 2023
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active package cooling structures using molded substrate packaging...
- Patent number 11,735,495
- Issue date Aug 22, 2023
- Intel Corporation
- Omkar Karhade
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,735,558
- Issue date Aug 22, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a bridge
- Patent number 11,676,900
- Issue date Jun 13, 2023
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
5G mmWave antenna architecture with thermal management
- Patent number 11,616,283
- Issue date Mar 28, 2023
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband multi-pin edge connector for radio frequency front end module
- Patent number 11,611,164
- Issue date Mar 21, 2023
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid thermal interface material in electronic packaging
- Patent number 11,581,240
- Issue date Feb 14, 2023
- Intel Corporation
- Kedar Dhane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with stud bump electrical connections
- Patent number 11,552,035
- Issue date Jan 10, 2023
- Intel Corporation
- Zhaozhi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,521,931
- Issue date Dec 6, 2022
- Intel Corporation
- Jason M. Gamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna boards and communication devices
- Patent number 11,522,291
- Issue date Dec 6, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin, hyper-density semiconductor packages
- Patent number 11,430,724
- Issue date Aug 30, 2022
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of utilizing low temperature solder assisted mounting techn...
- Patent number 11,417,592
- Issue date Aug 16, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,373,972
- Issue date Jun 28, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,328,937
- Issue date May 10, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMORY STACKS INCLUDING REPLACEMENT BLOCKS AND RELATED METHODS
- Publication number 20240357839
- Publication date Oct 24, 2024
- Nitin Ashok Deshpande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20240347590
- Publication date Oct 17, 2024
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN
- Publication number 20240319437
- Publication date Sep 26, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...
- Publication number 20240272388
- Publication date Aug 15, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20240136292
- Publication date Apr 25, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques For Arranging Conductive Pads In Electronic Devices
- Publication number 20240120302
- Publication date Apr 11, 2024
- Intel Corporation
- Krishna Bharath Kolluru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...
- Publication number 20240113088
- Publication date Apr 4, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES
- Publication number 20240063089
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...
- Publication number 20240063147
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES
- Publication number 20240063180
- Publication date Feb 22, 2024
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063178
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063066
- Publication date Feb 22, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...
- Publication number 20240063183
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES
- Publication number 20240063072
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...
- Publication number 20240063202
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIBER ARRAY UNIT (FAU) DESIGNS TO ENABLE A HIGHER IO BANDWIDTH PER...
- Publication number 20240061192
- Publication date Feb 22, 2024
- Intel Corporation
- Chia-Pin CHIU
- G02 - OPTICS
Information Patent Application
SPLIT METALLIZATION LAYERS IN MULTICHIP DEVICES
- Publication number 20240063133
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH ELECTRICALLY ACTIVE FIDUCIALS
- Publication number 20240063136
- Publication date Feb 22, 2024
- Intel Corporation
- Haris Khan Niazi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES
- Publication number 20240063142
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET
- Publication number 20240063143
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
- Publication number 20240030116
- Publication date Jan 25, 2024
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT
- Publication number 20240021522
- Publication date Jan 18, 2024
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF SCALABLE COMPUTE WALL HAVING COMPUTE BRICK...
- Publication number 20240006395
- Publication date Jan 4, 2024
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATE...
- Publication number 20240006332
- Publication date Jan 4, 2024
- Intel Corporation
- Dimitrios Antartis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING
- Publication number 20240006358
- Publication date Jan 4, 2024
- Intel Corporation
- Zhihua Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH COMPUTE BRICKS HAVING VERTICALLY STACKED...
- Publication number 20240006375
- Publication date Jan 4, 2024
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH IN...
- Publication number 20230420411
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIE...
- Publication number 20230420432
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
- Publication number 20230420376
- Publication date Dec 28, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...
- Publication number 20230420436
- Publication date Dec 28, 2023
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS

Omkar Karhade

Person

Patents Grantslast 30 patents

Optical multichip package with multiple system-on-chip dies

Microelectronic structures including bridges

Microelectronic structures including bridges

Dummy die structures of a packaged integrated circuit device

Patch on interposer architecture for low cost optical co-packaging

Silicon groove architectures and manufacturing processes for passiv...

Open cavity bridge power delivery architectures and processes

In-package 3D antenna

Microelectronic structures including bridges

Microelectronic structures including bridges

Underfill material flow control for reduced die-to-die spacing in s...

Microelectronic structures including bridges

Wirebond and leadframe magnetic inductors

Multichip semiconductor package including a bridge die disposed in...

Low cost package warpage solution

Active package cooling structures using molded substrate packaging...

Microelectronic structures including bridges

Electronic assembly that includes a bridge

5G mmWave antenna architecture with thermal management

Wideband multi-pin edge connector for radio frequency front end module

Liquid thermal interface material in electronic packaging

Coupled cooling fins in ultra-small systems

Electronic package with stud bump electrical connections

Thermal management solutions for integrated circuit packages

Microelectronic structures including bridges

Antenna boards and communication devices

Ultra-thin, hyper-density semiconductor packages

Methods of utilizing low temperature solder assisted mounting techn...

Microelectronic structures including bridges

Low cost package warpage solution

Patents Applicationslast 30 patents

MEMORY STACKS INCLUDING REPLACEMENT BLOCKS AND RELATED METHODS

METHODS AND APPARATUS TO REDUCE STRESS IN INTEGRATED CIRCUIT PACKAGES

PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN

ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

Techniques For Arranging Conductive Pads In Electronic Devices

INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...

THERMAL MANAGEMENT OF BASE DIES IN MULTICHIP COMPOSITE DEVICES

DEVICE, METHOD, AND SYSTEM TO PROTECT THROUGH-DIELECTRIC VIAS OF A...

IC DIE COMPOSITES WITH INORGANIC INTER-DIE FILL STRUCTURES

QUASI-MONOLITHIC DIE ARCHITECTURES

TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES

MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...

LASER ASSISTED ETCHING OF DIELECTRICS IN IC DEVICES

PACKAGE ARCHITECTURE WITH INTEGRATED CAPACITORS IN QUASI-MONOLITHIC...

FIBER ARRAY UNIT (FAU) DESIGNS TO ENABLE A HIGHER IO BANDWIDTH PER...

SPLIT METALLIZATION LAYERS IN MULTICHIP DEVICES

INTEGRATED CIRCUIT DEVICE WITH ELECTRICALLY ACTIVE FIDUCIALS

DIE CRACK MITIGATION IN MULTI-CHIP COMPOSITE IC STRUCTURES

DEVICE, METHOD, AND SYSTEM TO MITIGATE WARPAGE OF A COMPOSITE CHIPLET

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

WIRELESS CHIP-TO-CHIP HIGH-SPEED DATA TRANSPORT

PACKAGE ARCHITECTURE OF SCALABLE COMPUTE WALL HAVING COMPUTE BRICK...

FIDUCIAL MARKS FOR VERIFYING ALIGNMENT ACCURACY OF BONDED INTEGRATE...

SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING

PACKAGE ARCHITECTURE WITH COMPUTE BRICKS HAVING VERTICALLY STACKED...

PACKAGE ARCHITECTURE OF THREE-DIMENSIONAL INTERCONNECT CUBE WITH IN...

PACKAGE ARCHITECTURE OF PHOTONIC SYSTEM WITH VERTICALLY STACKED DIE...

MICROELECTRONIC STRUCTURES INCLUDING BRIDGES

PACKAGE ARCHITECTURE WITH VERTICAL STACKING OF INTEGRATED CIRCUIT D...