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Patents Grants
last 30 patents
Information
Patent Grant
Method for forming reinforced interconnects on a substrate
Patent number
7,494,924
Issue date
Feb 24, 2009
FREESCALE SEMICONDUCTOR, INC.
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for forming multi-layer bumps on a substrate
Patent number
7,422,973
Issue date
Sep 9, 2008
Freescale Semiconductor, Inc.
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for forming multi-layer bumps on a substrate
Patent number
7,279,409
Issue date
Oct 9, 2007
FREESCALE SEMICONDUCTOR, INC.
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Three-dimensional package
Patent number
7,262,494
Issue date
Aug 28, 2007
FREESCALE SEMICONDUCTOR, INC.
Hei Ming Shiu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method for forming reinforced interconnects on a substrate
Publication number
20070207605
Publication date
Sep 6, 2007
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for fabricating a PCB
Publication number
20070178228
Publication date
Aug 2, 2007
Hei Ming Shiu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Method for forming multi-layer bumps on a substrate
Publication number
20070178688
Publication date
Aug 2, 2007
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for forming multi-layer bumps on a substrate
Publication number
20070099413
Publication date
May 3, 2007
Hei Ming Shiu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Three-dimensional package and method of forming same
Publication number
20060208363
Publication date
Sep 21, 2006
Hei Ming Shiu
H01 - BASIC ELECTRIC ELEMENTS