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last 30 patents
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Patent Grant
Leadless package with non-collapsible bump
Patent number
10,269,751
Issue date
Apr 23, 2019
Nexperia B.V.
Wai Wong Chow
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
LEADLESS PACKAGE WITH NON-COLLAPSIBLE BUMP
Publication number
20180122763
Publication date
May 3, 2018
Nexperia B.V.
Wai Wong Chow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
Publication number
20170170103
Publication date
Jun 15, 2017
Nexperia B.V.
SHUN TIK YEUNG
H01 - BASIC ELECTRIC ELEMENTS