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Orlando F. Torres
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Richardson, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Direct bumping on integrated circuit contacts enabled by metal-to-i...
Patent number
7,271,030
Issue date
Sep 18, 2007
Texas Instruments Incorporated
Christo P. Bojkov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct bumping on integrated circuit contacts enabled by metal-to-i...
Patent number
7,005,752
Issue date
Feb 28, 2006
Texas Instruments Incorporated
Christo P. Bojkov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat dissipating flip-chip ball grid array
Patent number
6,657,311
Issue date
Dec 2, 2003
Texas Instruments Incorporated
Edgardo R. Hortaleza
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stitch bond enhancement for hard-to-bond materials
Patent number
5,960,262
Issue date
Sep 28, 1999
Texas Instruments Incorporated
Orlando F. Torres
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
System and Method for Improving Reliability of Integrated Circuit P...
Publication number
20110204511
Publication date
Aug 25, 2011
TEXAS INSTRUMENTS INCORPORATED
Stanley Craig BEDDINGFIELD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System and Method for Improving Reliability of Integrated Circuit P...
Publication number
20090140401
Publication date
Jun 4, 2009
Stanley Craig Beddingfield
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Direct bumping on integrated circuit contacts enabled by metal-to-i...
Publication number
20060091541
Publication date
May 4, 2006
Christo P. Bojkov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Direct bumping on integrated circuit contacts enabled by metal-to-i...
Publication number
20050082685
Publication date
Apr 21, 2005
Christo P. Bojkov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT DISSIPATING FLIP-CHIP BALL GRID ARRAY
Publication number
20030214049
Publication date
Nov 20, 2003
Edgardo R. Hortaleza
H01 - BASIC ELECTRIC ELEMENTS