Ortrud Steinius

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Wuppertal, DE

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Patents Grantslast 30 patents

Information Patent Grant
Tin-silver solder bumping in electronics manufacture
- Patent number 7,713,859
- Issue date May 11, 2010
- Enthone Inc.
- Thomas B. Richardson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metal coating of substrates
- Patent number 6,589,593
- Issue date Jul 8, 2003
- Blasberg Oberflächentechnik GmbH
- Jürgen Hupe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
TIN-SILVER SOLDER BUMPING IN ELECTRONICS MANUFACTURE
- Publication number 20070037377
- Publication date Feb 15, 2007
- Enthone Inc.
- Thomas B. Richardson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for bronze galvanic coating
- Publication number 20060137991
- Publication date Jun 29, 2006
- Enthone Inc.
- Katrin Zschintzsch
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for electrodeposition of bronzes
- Publication number 20050263403
- Publication date Dec 1, 2005
- Enthone Inc.
- Katrin Zschintzsch
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR THE DEPOSITION OF A SILVER-TIN ALLOY
- Publication number 20030024822
- Publication date Feb 6, 2003
- Ortrud Steinius
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR