Osami Hayashi

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Saitama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for the preparation of a hot-melt adhesive interconnector
- Patent number 5,041,183
- Issue date Aug 20, 1991
- Shin-Etsu Polymer Co., Ltd.
- Akio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the preparation of an emboss-worked plastic card
- Patent number 5,034,081
- Issue date Jul 23, 1991
- Shin-Etsu Polymer Co., Ltd.
- Katsuhisa Aizawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for electrically connecting IC chips, a resinous bump-formin...
- Patent number 4,917,466
- Issue date Apr 17, 1990
- Shin-Etsu Polymer Co., Ltd.
- Akio Nakamura
- G02 - OPTICS
Information Patent Grant
Colored ink ribbon of electrothermal transfer type for thermal prin...
- Patent number 4,775,578
- Issue date Oct 4, 1988
- Shin-Etsu Polymer Co., Ltd.
- Osami Hayashi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS