Osamu Endo

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Omiya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Film thickness measuring apparatus, film thickness measuring method...
- Patent number 5,657,123
- Issue date Aug 12, 1997
- Mitsubishi Materials Corp.
- Katsumi Mogi
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing apparatus
- Patent number 5,584,751
- Issue date Dec 17, 1996
- Mitsubishi Materials Corporation
- Hiroyuki Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Truing apparatus for wafer polishing pad
- Patent number 5,531,635
- Issue date Jul 2, 1996
- Mitsubishi Materials Corporation
- Katsumi Mogi
- B24 - GRINDING POLISHING