Osamu Futonagane

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Ogaki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board
- Patent number 10,095,330
- Issue date Oct 9, 2018
- Ibiden Co., Ltd.
- Toru Furuta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package substrate and method for manufacturing package substrate
- Patent number 9,716,059
- Issue date Jul 25, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160295691
- Publication date Oct 6, 2016
- IBIDEN CO., LTD.
- Toru FURUTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20160086885
- Publication date Mar 24, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE
- Publication number 20160064318
- Publication date Mar 3, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS