Osamu Higashi

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat sink for measuring temperature of electronic component
- Patent number 8,974,116
- Issue date Mar 10, 2015
- Fujitsu Limited
- Tomomi Okamoto
- G01 - MEASURING TESTING
Information Patent Grant
Reflow soldering apparatus and reflow soldering method
- Patent number 6,971,571
- Issue date Dec 6, 2005
- Fujitsu Limited
- Naoaki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF SOLDERING AN ELECTRONIC COMPONENT
- Publication number 20110072655
- Publication date Mar 31, 2011
- Fujitsu Limited
- Fumigi KOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK FOR MEASURING TEMPERATURE OF ELECTRONIC COMPONENT
- Publication number 20100254426
- Publication date Oct 7, 2010
- FUJITSU LIMITED
- Tomomi OKAMOTO
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR DISMOUNTING ELECTRONIC DEVICE
- Publication number 20100223775
- Publication date Sep 9, 2010
- FUJITSU LIMITED
- Osamu HIGASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reflow soldering apparatus and reflow soldering method
- Publication number 20030213833
- Publication date Nov 20, 2003
- FUJITSU LIMITED
- Naoaki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR