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Osamu Horie
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Shimodate, JP
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last 30 patents
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Patent Grant
Resin-encapsulated semiconductor device
Patent number
5,567,990
Issue date
Oct 22, 1996
Hitachi Chemical Company, Ltd.
Tatsuo Kawata
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Plastic molded type electronic device
Patent number
5,181,097
Issue date
Jan 19, 1993
Hitachi, Ltd.
Masatsugu Ogata
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...