Osamu Horiuchi

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Akishima, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a molded semiconductor device having blocking...
- Patent number 5,525,547
- Issue date Jun 11, 1996
- Hitachi, Ltd.
- Toshihiro Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a leadframe and metal substrate
- Patent number 5,448,105
- Issue date Sep 5, 1995
- Dia Nippon Printing Co., Ltd.
- Kazunori Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 5,304,844
- Issue date Apr 19, 1994
- Hitachi, Ltd.
- Osamu Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer leadframes, electrically conductive plates used therefo...
- Patent number 5,250,839
- Issue date Oct 5, 1993
- Dai Nippon Printing Co., Ltd.
- Kazunori Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 5,032,895
- Issue date Jul 16, 1991
- Hitachi, Ltd.
- Osamu Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS