Osamu Igawa

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,513,800
- Issue date Aug 20, 2013
- Fujitsu Semiconductor Limited
- Takaki Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having adhesive squeeze-out prevention conf...
- Patent number 8,421,219
- Issue date Apr 16, 2013
- Fujitsu Limited
- Tsuyoshi So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having adhesive squeeze-out prevention conf...
- Patent number 7,999,374
- Issue date Aug 16, 2011
- Fujitsu Limited
- Tsuyoshi So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,813,133
- Issue date Oct 12, 2010
- Fujitsu Semiconductor Limited
- Makoto Iijima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device
- Patent number 7,064,645
- Issue date Jun 20, 2006
- Fujitsu Limited
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device configured to be surface mountable
- Patent number 6,836,025
- Issue date Dec 28, 2004
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contactor, method for manufacturing such contactor, and testing met...
- Patent number 6,767,219
- Issue date Jul 27, 2004
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD OF SEMICONDUCTOR C...
- Publication number 20110254149
- Publication date Oct 20, 2011
- Fujitsu Limited
- Tsuyoshi So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component and manufacturing method of semiconductor c...
- Publication number 20100013089
- Publication date Jan 21, 2010
- FUJITSU LIMITED
- Tsuyoshi So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20080067671
- Publication date Mar 20, 2008
- Fujitsu Limited
- Takaki Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070139892
- Publication date Jun 21, 2007
- FUJITSU LIMITED
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030227095
- Publication date Dec 11, 2003
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contactor, method for manufacturing such contactor, and testing met...
- Publication number 20030186566
- Publication date Oct 2, 2003
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Application
Electronic device
- Publication number 20030127704
- Publication date Jul 10, 2003
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Osamu Igawa

Person

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Semiconductor component having adhesive squeeze-out prevention conf...

Semiconductor component having adhesive squeeze-out prevention conf...

Semiconductor device

Electronic device

Semiconductor device configured to be surface mountable

Contactor, method for manufacturing such contactor, and testing met...

Patents Applicationslast 30 patents

SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD OF SEMICONDUCTOR C...

Semiconductor component and manufacturing method of semiconductor c...

Semiconductor device and method for manufacturing the same

Semiconductor device

Semiconductor device and manufacturing method thereof

Contactor, method for manufacturing such contactor, and testing met...

Electronic device