Osamu ISHIKAWA

Follow

Person

Takasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonded SOI wafer
- Patent number 10,566,196
- Issue date Feb 18, 2020
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor wafer and method for manufacturing bonded semi...
- Patent number 10,283,401
- Issue date May 7, 2019
- Shin-Etsu Handotai Co., Ltd.
- Osamu Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING BONDED SOI WAFER
- Publication number 20180122639
- Publication date May 3, 2018
- Shin-Etsu Handotai Co., Ltd.
- Norihiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING BONDED SEMI...
- Publication number 20180033681
- Publication date Feb 1, 2018
- Shin-Etsu Handotai Co., Ltd.
- Osamu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS