Osamu Kitamura

Follow

Person

Himeji, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Gold-alloy bonding wire
- Patent number 5,989,364
- Issue date Nov 23, 1999
- Nippon Steel Corporation
- Osamu Kitamura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of producing fine metal spheres of uniform size
- Patent number 5,761,779
- Issue date Jun 9, 1998
- Nippon Steel Corporation
- Tadakatsu Maruyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin gold-alloy wire for semiconductor device
- Patent number 5,658,664
- Issue date Aug 19, 1997
- Nippon Steel Corporation
- Tomohiro Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Palladium alloy thin wire for wire bonding semiconductor elements
- Patent number 5,637,274
- Issue date Jun 10, 1997
- Nippon Steel Corporation
- Osamu Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for continuous casting of a slightly deoxidized steel slab
- Patent number 4,298,050
- Issue date Nov 3, 1981
- Nippon Steel Corporation
- Tetsro Ohashi
- B22 - CASTING POWDER METALLURGY