Osamu Miura

Person

Tsukuba-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thin-film multilayer wiring board with wiring and via holes in a th...
- Patent number 6,326,561
- Issue date Dec 4, 2001
- Hitachi, Ltd.
- Ryuji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film multilayer wiring board and production thereof
- Patent number 6,190,493
- Issue date Feb 20, 2001
- Hitachi, Ltd.
- Ryuji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer wiring structure
- Patent number 5,768,108
- Issue date Jun 16, 1998
- Hitachi, Ltd.
- Osamu Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LSI package board
- Patent number 5,565,706
- Issue date Oct 15, 1996
- Hitachi, Ltd.
- Osamu Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making electrical connections in the manufacture of wirin...
- Patent number 5,497,545
- Issue date Mar 12, 1996
- Hitachi, Ltd.
- Ryuji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting substrate
- Patent number 5,350,886
- Issue date Sep 27, 1994
- Hitachi, Ltd.
- Kunio Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-organic macromolecular synthetic resin composite and process...
- Patent number 5,178,962
- Issue date Jan 12, 1993
- Hitachi, Ltd.
- Toshio Miyamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for producing metal-polyimide composite article
- Patent number 5,133,989
- Issue date Jul 28, 1992
- Hitachi, Ltd.
- Shunichi Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing metal/polyimide composite article
- Patent number 5,120,573
- Issue date Jun 9, 1992
- Hitachi, Ltd.
- Kunio Miyazaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor package and computer using the package
- Patent number 5,095,359
- Issue date Mar 10, 1992
- Hitachi, Ltd.
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming wiring on substrate
- Patent number 4,886,573
- Issue date Dec 12, 1989
- Hitachi, Ltd.
- Hiroshi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CATHODE SUBSTRATE HAVING CATHODE ELECTRODE LAYER, INSULATOR LAYER,...
- Publication number 20090325452
- Publication date Dec 31, 2009
- ULVAC, Inc.
- Haruhisa NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cathode substrate and its manufacturing method
- Publication number 20050230750
- Publication date Oct 20, 2005
- Haruhisa Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for the preparation of graphite nanofibers and emitter and d...
- Publication number 20050099111
- Publication date May 12, 2005
- Masaaki Hirakawa
- C30 - CRYSTAL GROWTH

Osamu Miura

Person

Patents Grantslast 30 patents

Thin-film multilayer wiring board with wiring and via holes in a th...

Thin-film multilayer wiring board and production thereof

Multi-layer wiring structure

LSI package board

Method of making electrical connections in the manufacture of wirin...

Mounting substrate

Metal-organic macromolecular synthetic resin composite and process...

Process for producing metal-polyimide composite article

Process for producing metal/polyimide composite article

Semiconductor package and computer using the package

Process for forming wiring on substrate

Patents Applicationslast 30 patents

CATHODE SUBSTRATE HAVING CATHODE ELECTRODE LAYER, INSULATOR LAYER,...

Cathode substrate and its manufacturing method

Method for the preparation of graphite nanofibers and emitter and d...