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Osamu Munekata

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Patents Grantslast 30 patents

  • Information Patent Grant

    Layered bonding material, semiconductor package, and power module
    • Patent number 11,712,760
    • Issue date Aug 1, 2023
    • Senju Metal Industry Co., Ltd.
    • Naoto Kameda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder alloy, solder power, and solder joint
    • Patent number 11,583,959
    • Issue date Feb 21, 2023
    • Senju Metal Industry Co., Ltd.
    • Hiroyoshi Kawasaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder material, solder paste, and solder joint
    • Patent number 11,344,976
    • Issue date May 31, 2022
    • Senju Metal Industry Co., Ltd.
    • Hiroyoshi Kawasaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder ball, solder joint, and joining method
    • Patent number 10,780,531
    • Issue date Sep 22, 2020
    • Senju Metal Industry Co., Ltd.
    • Hiroyoshi Kawasaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 8,216,395
    • Issue date Jul 10, 2012
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 7,682,468
    • Issue date Mar 23, 2010
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of replenishing an oxidation suppressing element in a solder...
    • Patent number 7,628,308
    • Issue date Dec 8, 2009
    • Senju Metal Industry Co., Ltd.
    • Masayuki Ojima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 7,338,567
    • Issue date Mar 4, 2008
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 7,029,542
    • Issue date Apr 18, 2006
    • Senju Metal Industry Co., Ltd.
    • Masazumi Amagai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder paste
    • Patent number 6,554,180
    • Issue date Apr 29, 2003
    • Senju Metal Industry Co., Ltd.
    • Rikiya Katoh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste for chip components
    • Patent number 6,050,480
    • Issue date Apr 18, 2000
    • Senju Metal Industry, Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents