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Osamu Nakagawa

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  • Itami-shi, Hyogo-ken, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of molding a semiconductor device
    • Patent number 4,908,178
    • Issue date Mar 13, 1990
    • Mitsubishi Denki Kabushiki Kaisha
    • Osamu Nakagawa
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Mold for molding semiconductor devices
    • Patent number 4,818,204
    • Issue date Apr 4, 1989
    • Osamu Nakagawa
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL