TREA

Osamu Nakano

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  • Ageo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Copper foil for printed wiring board
    • Patent number 6,544,664
    • Issue date Apr 8, 2003
    • Mitsui Mining & Smelting Co., Ltd.
    • Naotomi Takahashi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electrodeposited copper foil
    • Patent number 6,544,663
    • Issue date Apr 8, 2003
    • Mitsui Mining & Smelting Co., Ltd.
    • Osamu Nakano
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents