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Osamu Nakano
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Ageo, JP
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last 30 patents
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Patent Grant
Copper foil for printed wiring board
Patent number
6,544,664
Issue date
Apr 8, 2003
Mitsui Mining & Smelting Co., Ltd.
Naotomi Takahashi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Electrodeposited copper foil
Patent number
6,544,663
Issue date
Apr 8, 2003
Mitsui Mining & Smelting Co., Ltd.
Osamu Nakano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Copper foil with carrier foil, process for producing the same and c...
Publication number
20040188263
Publication date
Sep 30, 2004
Akiko Sugimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR