Osamu Oka

Person

Yaizu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition for semiconductor device and adhesive sheet fo...
- Patent number 6,770,370
- Issue date Aug 3, 2004
- Tomoegawa Paper Co., Ltd.
- Naoji Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition and adhesive sheet for semiconductor devices
- Patent number 6,617,021
- Issue date Sep 9, 2003
- Tomoegawa Paper Co., Inc.
- Masaharu Kobayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive tape for electronic parts
- Patent number 6,395,391
- Issue date May 28, 2002
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive for electronic parts and adhesive tape for electronic parts
- Patent number 6,329,050
- Issue date Dec 11, 2001
- Tomoegawa Paper Co., Ltd.
- Ken Yoshioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Heat-resisting adhesive composition and adhesive tapes for electron...
- Patent number 6,268,033
- Issue date Jul 31, 2001
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for electronic parts
- Patent number 6,265,042
- Issue date Jul 24, 2001
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for electronic parts
- Patent number 6,228,452
- Issue date May 8, 2001
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for electronic parts and adhesive tape for electronic parts
- Patent number 6,187,874
- Issue date Feb 13, 2001
- Tomoegawa Paper Co., Ltd.
- Ken Yoshioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for electronic parts and liquid adhesive
- Patent number 6,184,337
- Issue date Feb 6, 2001
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive tape for electronic parts
- Patent number 6,132,865
- Issue date Oct 17, 2000
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive tape for electronic parts
- Patent number 6,045,886
- Issue date Apr 4, 2000
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for electronic parts and liquid adhesive
- Patent number 5,959,068
- Issue date Sep 28, 1999
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive tape for electronic parts
- Patent number 5,891,540
- Issue date Apr 6, 1999
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for electronic parts and liquid adhesive
- Patent number 5,866,250
- Issue date Feb 2, 1999
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive tape for electronic parts and liquid adhesive
- Patent number 5,851,616
- Issue date Dec 22, 1998
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyaniline derivatives and their production process
- Patent number 5,821,309
- Issue date Oct 13, 1998
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive tape for electronic parts and liquid adhesive
- Patent number 5,725,948
- Issue date Mar 10, 1998
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide and process for producing the same
- Patent number 5,723,571
- Issue date Mar 3, 1998
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide AMD process for producing the same
- Patent number 5,696,235
- Issue date Dec 9, 1997
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimide and process for producing the same
- Patent number 5,663,287
- Issue date Sep 2, 1997
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyaniline derivatives and their production process
- Patent number 5,635,563
- Issue date Jun 3, 1997
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyaniline derivatives and their production process
- Patent number 5,623,020
- Issue date Apr 22, 1997
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyaniline derivatives and their production process
- Patent number 5,621,053
- Issue date Apr 15, 1997
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyaniline derivatives and their production process
- Patent number 5,574,131
- Issue date Nov 12, 1996
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composite comprising paper and electro-conducting polymers and its...
- Patent number 5,421,959
- Issue date Jun 6, 1995
- Tomegawa Paper Co., Ltd.
- Osamu Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite comprising paper and electro-conducting polymers and its...
- Patent number 5,336,374
- Issue date Aug 9, 1994
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyaniline derivative containing at least a 2-butenylene structure
- Patent number 5,304,613
- Issue date Apr 19, 1994
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyaniline derivatives and their production process
- Patent number 5,254,670
- Issue date Oct 19, 1993
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyaniline derivatives and their production process
- Patent number 5,250,639
- Issue date Oct 5, 1993
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyaniline derivatives and their production process
- Patent number 5,237,023
- Issue date Aug 17, 1993
- Tomoegawa Paper Co., Ltd.
- Osamu Oka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Adhesive sheet for producing semiconductor devices
- Publication number 20030190466
- Publication date Oct 9, 2003
- Katsuji Nakaba
- B32 - LAYERED PRODUCTS
Information Patent Application
Adhesive composition for semiconductor device and adhesive sheet fo...
- Publication number 20030111174
- Publication date Jun 19, 2003
- Naoji Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive composition and adhesive sheet for semiconductor devices
- Publication number 20020155286
- Publication date Oct 24, 2002
- Masaharu Kobayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Adhesive composition for semiconductor device and adhesive sheet fo...

Adhesive composition and adhesive sheet for semiconductor devices

Adhesive tape for electronic parts

Adhesive for electronic parts and adhesive tape for electronic parts

Heat-resisting adhesive composition and adhesive tapes for electron...

Adhesive tape for electronic parts

Adhesive tape for electronic parts

Adhesive for electronic parts and adhesive tape for electronic parts

Adhesive tape for electronic parts and liquid adhesive

Adhesive tape for electronic parts

Adhesive tape for electronic parts

Adhesive tape for electronic parts and liquid adhesive

Adhesive tape for electronic parts

Adhesive tape for electronic parts and liquid adhesive

Adhesive tape for electronic parts and liquid adhesive

Polyaniline derivatives and their production process

Adhesive tape for electronic parts and liquid adhesive

Polyimide and process for producing the same

Polyimide AMD process for producing the same

Polyimide and process for producing the same

Polyaniline derivatives and their production process

Polyaniline derivatives and their production process

Polyaniline derivatives and their production process

Polyaniline derivatives and their production process

Composite comprising paper and electro-conducting polymers and its...

Composite comprising paper and electro-conducting polymers and its...

Polyaniline derivative containing at least a 2-butenylene structure

Polyaniline derivatives and their production process

Polyaniline derivatives and their production process

Polyaniline derivatives and their production process

Patents Applicationslast 30 patents

Adhesive sheet for producing semiconductor devices

Adhesive composition for semiconductor device and adhesive sheet fo...

Adhesive composition and adhesive sheet for semiconductor devices