Osamu Taniguchi

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit substrate and method for fabricating the same
- Patent number 7,678,695
- Issue date Mar 16, 2010
- Fujitsu Limited
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor system-in-package
- Patent number 7,557,014
- Issue date Jul 7, 2009
- Fujitsu Limited
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive material and method for filling via-hole
- Patent number 7,531,115
- Issue date May 12, 2009
- Fujitsu Limited
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and method for fabricating the same
- Patent number 7,211,899
- Issue date May 1, 2007
- Fujitsu Limited
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor system-in-package
- Patent number 7,176,556
- Issue date Feb 13, 2007
- Fujitsu Limited
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for fabricating the same
- Patent number 7,139,176
- Issue date Nov 21, 2006
- Fujitsu Limited
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic circuit component
- Patent number 6,979,644
- Issue date Dec 27, 2005
- Fujitsu Limited
- Koji Omote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive material and method for filling via-hole
- Patent number 6,886,248
- Issue date May 3, 2005
- Fujitsu Limited
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-film circuit substrate
- Patent number 6,768,205
- Issue date Jul 27, 2004
- Fujitsu Limited
- Osamu Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Circuit substrate and method for fabricating the same
- Publication number 20070155174
- Publication date Jul 5, 2007
- FIJITSU LIMITED
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor system-in-package
- Publication number 20070065981
- Publication date Mar 22, 2007
- FUJITSU LIMITED
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive material and method for filling via-hole
- Publication number 20050147522
- Publication date Jul 7, 2005
- FUJITSU LIMITED
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing electronic circuit component
- Publication number 20030200654
- Publication date Oct 30, 2003
- FUJITSU LIMITED
- Koji Omote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate and method for fabricating the same
- Publication number 20030137056
- Publication date Jul 24, 2003
- FUJITSU LIMITED
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive material and method for filling via-hole
- Publication number 20030135997
- Publication date Jul 24, 2003
- FUJITSU LIMITED
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit substrate and method for fabricating the same
- Publication number 20030116857
- Publication date Jun 26, 2003
- FUJITSU LIMITED
- Osamu Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor system-in-package
- Publication number 20030080400
- Publication date May 1, 2003
- FUJITSU LIMITED
- Keishiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin-film circuit substrate and manufacturing method thereof, and a...
- Publication number 20030045085
- Publication date Mar 6, 2003
- FUJITSU LIMITED
- Osamu Taniguchi
- H01 - BASIC ELECTRIC ELEMENTS

Osamu Taniguchi

Person

Patents Grantslast 30 patents

Circuit substrate and method for fabricating the same

Semiconductor system-in-package

Conductive material and method for filling via-hole

Circuit substrate and method for fabricating the same

Semiconductor system-in-package

Circuit substrate and method for fabricating the same

Method of manufacturing electronic circuit component

Conductive material and method for filling via-hole

Thin-film circuit substrate

Patents Applicationslast 30 patents

Circuit substrate and method for fabricating the same

Semiconductor system-in-package

Conductive material and method for filling via-hole

Method of manufacturing electronic circuit component

Circuit substrate and method for fabricating the same

Conductive material and method for filling via-hole

Circuit substrate and method for fabricating the same

Semiconductor system-in-package

Thin-film circuit substrate and manufacturing method thereof, and a...